CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

CL31X226KAHN3NE

Manufacturer No:

905

Quantity:

9999

Model:

default

Datasheet:

CL31X226KAHN3NE

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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CL31X226KAHN3NE

CAP CER 22UF 25V X6S 1206

  • Type
    Parameter
    Select All
  • Mfr

    Samsung Electro-Mechanics

  • Series

    CL

  • Package

    Tape & Reel (TR)

  • Product Status

    Active

  • Capacitance

    22 µF

  • Tolerance

    ±10%

  • Voltage - Rated

    25V

  • Temperature Coefficient

    X6S

  • Operating Temperature

    -55°C ~ 105°C

  • Features

    -

  • Ratings

    -

  • Applications

    General Purpose

  • Failure Rate

    -

  • Mounting Type

    Surface Mount, MLCC

  • Package / Case

    1206 (3216 Metric)

  • Size / Dimension

    0.126" L x 0.063" W (3.20mm x 1.60mm)

  • Height - Seated (Max)

    -

  • Thickness (Max)

    0.071" (1.80mm)

  • Lead Spacing

    -

  • Lead Style

    -

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  • Description:

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