CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

C3216C0G2J103J160AA

Manufacturer No:

165

Manufacturer:

TDK Corporation

Quantity:

9999

Model:

default

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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C3216C0G2J103J160AA

CAP CER 10000PF 630V C0G 1206

  • Type
    Parameter
    Select All
  • Applications

    General Purpose

  • Failure Rate

    -

  • Mounting Type

    Surface Mount, MLCC

  • Package / Case

    1206 (3216 Metric)

  • Size / Dimension

    0.126" L x 0.063" W (3.20mm x 1.60mm)

  • Height - Seated (Max)

    -

  • Thickness (Max)

    0.071" (1.80mm)

  • Lead Spacing

    -

  • Lead Style

    -

  • Mfr

    TDK Corporation

  • Series

    C

  • Package

    Tape & Reel (TR)

  • Product Status

    Active

  • Capacitance

    10000 pF

  • Tolerance

    ±5%

  • Voltage - Rated

    630V

  • Temperature Coefficient

    C0G, NP0

  • Operating Temperature

    -55°C ~ 125°C

  • Features

    -

  • Ratings

    -

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