CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

B58035U9754M062

Manufacturer No:

106

Manufacturer:

EPCOS - TDK Electronics

Quantity:

9999

Model:

default

Datasheet:

B58035U9754M062

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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B58035U9754M062

CAP CER 0.75UF 900V 6SMD

  • Type
    Parameter
    Select All
  • Mfr

    EPCOS - TDK Electronics

  • Series

    CeraLink™ FA3

  • Package

    Tape & Reel (TR)

  • Product Status

    Active

  • Capacitance

    0.75 µF

  • Tolerance

    ±20%

  • Voltage - Rated

    900V

  • Temperature Coefficient

    -

  • Operating Temperature

    -40°C ~ 150°C

  • Features

    Low ESL (Stacked), High Temperature

  • Ratings

    AEC-Q200

  • Applications

    Automotive, SMPS Filtering

  • Failure Rate

    -

  • Mounting Type

    Surface Mount, MLCC

  • Package / Case

    Stacked SMD, 6 J-Lead

  • Size / Dimension

    0.343" L x 0.289" W (8.70mm x 7.34mm)

  • Height - Seated (Max)

    -

  • Thickness (Max)

    0.378" (9.60mm)

  • Lead Spacing

    -

  • Lead Style

    J-Lead

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