CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

LG126Z103MAT2S1

Manufacturer No:

38

Manufacturer:

KYOCERA AVX

Quantity:

9999

Model:

default

Datasheet:

LG126Z103MAT2S1

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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LG126Z103MAT2S1

CAP CER 10000PF 6.3V X7S 0204

  • Type
    Parameter
    Select All
  • Mfr

    KYOCERA AVX

  • Series

    LG12 (LGA)

  • Package

    Tape & Reel (TR)

  • Product Status

    Active

  • Capacitance

    10000 pF

  • Tolerance

    ±20%

  • Voltage - Rated

    6.3V

  • Temperature Coefficient

    X7S

  • Operating Temperature

    -55°C ~ 125°C

  • Features

    Low ESL (Reverse Geometry)

  • Ratings

    -

  • Applications

    Bypass, Decoupling

  • Mounting Type

    Surface Mount, MLCC

  • Package / Case

    0204 (0510 Metric)

  • Size / Dimension

    0.020" L x 0.039" W (0.50mm x 1.00mm)

  • Height - Seated (Max)

    -

  • Thickness (Max)

    0.022" (0.55mm)

  • Lead Spacing

    -

  • Lead Style

    -

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