CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

560L104YTT

Manufacturer No:

270

Quantity:

9999

Model:

default

Datasheet:

560L104YTT

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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560L104YTT

CAP CER 0.1UF 16V 0402

  • Type
    Parameter
    Select All
  • Mfr

    American Technical Ceramics

  • Series

    UBC™ ATC 560L

  • Package

    Tape & Reel (TR)

  • Product Status

    Active

  • Capacitance

    0.1 µF

  • Tolerance

    -20%, +25%

  • Voltage - Rated

    16V

  • Temperature Coefficient

    -

  • Operating Temperature

    -55°C ~ 125°C

  • Features

    -

  • Ratings

    -

  • Applications

    RF, Microwave, High Frequency, Bypass, Decoupling

  • Failure Rate

    -

  • Mounting Type

    Surface Mount, MLCC

  • Package / Case

    0402 (1005 Metric)

  • Size / Dimension

    0.040" L x 0.020" W (1.02mm x 0.51mm)

  • Height - Seated (Max)

    -

  • Thickness (Max)

    0.024" (0.61mm)

  • Lead Spacing

    -

  • Lead Style

    -

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