CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

CGA6M3X7R1H225K200AB

Manufacturer No:

165

Manufacturer:

TDK Corporation

Quantity:

9999

Model:

default

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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CGA6M3X7R1H225K200AB

CAP CER 2.2UF 50V X7R 1210

  • Type
    Parameter
    Select All
  • Mfr

    TDK Corporation

  • Series

    CGA

  • Package

    Tape & Reel (TR)

  • Product Status

    Active

  • Capacitance

    2.2 µF

  • Tolerance

    ±10%

  • Voltage - Rated

    50V

  • Temperature Coefficient

    X7R

  • Operating Temperature

    -55°C ~ 125°C

  • Features

    -

  • Ratings

    AEC-Q200

  • Applications

    Automotive

  • Failure Rate

    -

  • Mounting Type

    Surface Mount, MLCC

  • Package / Case

    1210 (3225 Metric)

  • Size / Dimension

    0.126" L x 0.098" W (3.20mm x 2.50mm)

  • Height - Seated (Max)

    -

  • Thickness (Max)

    0.087" (2.20mm)

  • Lead Spacing

    -

  • Lead Style

    -

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