CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

25EMPPC603E2BB200Z

Manufacturer No:

426

Manufacturer:

IBM

Quantity:

9999

Model:

default

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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25EMPPC603E2BB200Z

IBM25EMPPC603 - POWERPC 603E

  • Type
    Parameter
    Select All
  • SATA

    -

  • USB

    -

  • Voltage - I/O

    2.5V, 3.3V

  • Operating Temperature

    0°C ~ 105°C (TJ)

  • Security Features

    -

  • Package / Case

    278-BBGA, FCBGA

  • Supplier Device Package

    278-FCPBGA (21x21)

  • Additional Interfaces

    -

  • Mfr

    IBM

  • Series

    -

  • Package

    Bulk

  • Product Status

    Active

  • Core Processor

    PowerPC EM603e

  • Number of Cores/Bus Width

    1 Core, 32-Bit

  • Speed

    200MHz

  • Co-Processors/DSP

    -

  • RAM Controllers

    -

  • Graphics Acceleration

    No

  • Display & Interface Controllers

    -

  • Ethernet

    -

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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