CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

MM908E622ACPEKR2

Manufacturer No:

156

Manufacturer:

NXP USA Inc.

Quantity:

9999

Model:

default

Datasheet:

MM908E622ACPEKR2

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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MM908E622ACPEKR2

IC QUAD HALF BRDG TRPL SW 54SOIC

  • Type
    Parameter
    Select All
  • Mfr

    NXP USA Inc.

  • Series

    -

  • Package

    Tape & Reel (TR)

  • Product Status

    Active

  • Applications

    Automotive Mirror Control

  • Core Processor

    HC08

  • Program Memory Type

    FLASH (16kB)

  • Controller Series

    908E

  • RAM Size

    512 x 8

  • Interface

    SCI, SPI

  • Number of I/O

    12

  • Voltage - Supply

    9V ~ 16V

  • Operating Temperature

    -40°C ~ 85°C

  • Mounting Type

    Surface Mount

  • Package / Case

    54-SSOP (0.295", 7.50mm Width) Exposed Pad

  • Supplier Device Package

    54-SOIC-EP

  • Base Product Number

    MM908E622

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