CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

Compare Image Name Manufacturer Quantity Weight(Kg) Size(LxWxH) Package Type Series Datasheet Mfr Features Base Product Number Current Rating (Amps) Operating Temperature Mounting Type Termination Material Flammability Rating Number of Positions or Pins (Grid) Housing Material Product Status Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Termination Post Length Contact Resistance
110-93-324-41-001000 110-93-324-41-001000 Mill-Max Manufacturing Corp.
RFQ

Min: 1

Mult: 1

0 0x0x0 Tube DIP, 0.3" (7.62mm) Row Spacing 110 download Mill-Max Manufacturing Corp. Open Frame 110-93 3 A -55°C ~ 125°C Through Hole Solder - 24 (2 x 12) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Active 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy 0.125" (3.18mm) -
20-823-90 20-823-90 Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Bulk DIP, 0.3" (7.62mm) Row Spacing Vertisockets™ 800 download Aries Electronics Closed Frame 20-823 1.5 A - Through Hole, Right Angle, Horizontal Solder UL94 V-0 20 (2 x 10) Polyamide (PA46), Nylon 4/6 Active 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze 0.145" (3.68mm) -
4601 4601 Keystone Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Bulk Transistor, TO-3 - download Keystone Electronics Closed Frame - Chassis Mount Solder UL94 V-0 3 (Oval) Polyester, Glass Filled Active - Tin - Brass - Tin - Brass - -
24-6554-11 24-6554-11 Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Bulk DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 55 download Aries Electronics Closed Frame 24-655 1 A - Through Hole Solder UL94 V-0 24 (2 x 12) Polyphenylene Sulfide (PPS), Glass Filled Active 0.100" (2.54mm) Gold - Beryllium Copper 0.100" (2.54mm) Gold - Beryllium Copper 0.110" (2.78mm) -
28-6554-10 28-6554-10 Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Bulk DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 55 download Aries Electronics Closed Frame 28-6554 1 A - Through Hole Solder UL94 V-0 28 (2 x 14) Polyphenylene Sulfide (PPS), Glass Filled Active 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper 0.110" (2.78mm) -
28-6554-11 28-6554-11 Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Bulk DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 55 download Aries Electronics Closed Frame 28-6554 1 A - Through Hole Solder UL94 V-0 28 (2 x 14) Polyphenylene Sulfide (PPS), Glass Filled Active 0.100" (2.54mm) Gold - Beryllium Copper 0.100" (2.54mm) Gold - Beryllium Copper 0.110" (2.78mm) -
32-6554-10 32-6554-10 Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Bulk DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 55 download Aries Electronics Closed Frame 32-6554 1 A - Through Hole Solder UL94 V-0 32 (2 x 16) Polyphenylene Sulfide (PPS), Glass Filled Active 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper 0.110" (2.78mm) -
32-6554-11 32-6554-11 Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Bulk DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 55 download Aries Electronics Closed Frame 32-6554 1 A - Through Hole Solder UL94 V-0 32 (2 x 16) Polyphenylene Sulfide (PPS), Glass Filled Active 0.100" (2.54mm) Gold - Beryllium Copper 0.100" (2.54mm) Gold - Beryllium Copper 0.110" (2.78mm) -
48-6554-10 48-6554-10 Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Bulk DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 55 download Aries Electronics Closed Frame 48-6554 1 A - Through Hole Solder UL94 V-0 48 (2 x 24) Polyphenylene Sulfide (PPS), Glass Filled Active 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper 0.110" (2.78mm) -
20-3518-10 20-3518-10 Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Tube DIP, 0.3" (7.62mm) Row Spacing 518 download Aries Electronics Open Frame 20-3518 3 A - Through Hole Solder UL94 V-0 20 (2 x 10) Polyamide (PA46), Nylon 4/6, Glass Filled Active 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass 0.125" (3.18mm) -
22-4518-10 22-4518-10 Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Bulk DIP, 0.4" (10.16mm) Row Spacing 518 download Aries Electronics Open Frame 22-4518 3 A - Through Hole Solder UL94 V-0 22 (2 x 11) Polyamide (PA46), Nylon 4/6, Glass Filled Active 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass 0.125" (3.18mm) -
28-6518-10 28-6518-10 Aries Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Tube DIP, 0.6" (15.24mm) Row Spacing 518 download Aries Electronics Open Frame 28-6518 3 A - Through Hole Solder UL94 V-0 28 (2 x 14) Polyamide (PA46), Nylon 4/6, Glass Filled Active 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass 0.125" (3.18mm) -
214-99-308-01-670800 214-99-308-01-670800 Mill-Max Manufacturing Corp.
RFQ

Min: 1

Mult: 1

0 0x0x0 Tube DIP, 0.3" (7.62mm) Row Spacing 214 download Mill-Max Manufacturing Corp. Closed Frame 214-99 3 A -55°C ~ 125°C Surface Mount Solder - 8 (2 x 4) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Active 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy 0.056" (1.42mm) -
117-93-656-41-005000 117-93-656-41-005000 Mill-Max Manufacturing Corp.
RFQ

Min: 1

Mult: 1

0 0x0x0 Tube DIP, 0.6" (15.24mm) Row Spacing 117 download Mill-Max Manufacturing Corp. Open Frame 117-93 3 A -55°C ~ 125°C Through Hole Solder UL94 V-0 56 (2 x 28) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Active 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy 0.125" (3.18mm) -
110-93-632-41-001000 110-93-632-41-001000 Mill-Max Manufacturing Corp.
RFQ

Min: 1

Mult: 1

0 0x0x0 Tube DIP, 0.6" (15.24mm) Row Spacing 110 download Mill-Max Manufacturing Corp. Open Frame 110-93 3 A -55°C ~ 125°C Through Hole Solder - 32 (2 x 16) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Active 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy 0.125" (3.18mm) -

Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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