CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

Compare Image Name Manufacturer Quantity Weight(Kg) Size(LxWxH) Package Type Series Datasheet Mfr Features Base Product Number Current Rating (Amps) Operating Temperature Mounting Type Termination Material Flammability Rating Number of Positions or Pins (Grid) Housing Material Product Status Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Termination Post Length Contact Resistance
AR 14-HZW/TN AR 14-HZW/TN Assmann WSW Components
RFQ

Min: 1

Mult: 1

0 0x0x0 Tube DIP, 0.3" (7.62mm) Row Spacing - download Assmann WSW Components Open Frame AR 14-HZ 3 A -40°C ~ 105°C Through Hole Wire Wrap UL94 V-0 14 (2 x 7) Thermoplastic, Polyester Active 0.100" (2.54mm) Gold - Beryllium Copper 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper - 4mOhm
AR 20-HZW/TN AR 20-HZW/TN Assmann WSW Components
RFQ

Min: 1

Mult: 1

0 0x0x0 Tube DIP, 0.3" (7.62mm) Row Spacing - download Assmann WSW Components Open Frame AR 20-HZ 3 A -40°C ~ 105°C Through Hole Wire Wrap UL94 V-0 20 (2 x 10) Thermoplastic, Polyester Active 0.100" (2.54mm) Gold - Beryllium Copper 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper - 4mOhm
A-CCS 028-Z-T A-CCS 028-Z-T Assmann WSW Components
RFQ

Min: 1

Mult: 1

0 0x0x0 Tube PLCC - download Assmann WSW Components Closed Frame A-CCS 02 1 A -40°C ~ 105°C Through Hole Solder UL94 V-0 28 (4 x 7) Polybutylene Terephthalate (PBT) Active 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze 0.100" (2.54mm) Tin 160.0µin (4.06µm) Phosphor Bronze 0.132" (3.35mm) 15mOhm
A-CCS 044-Z-T A-CCS 044-Z-T Assmann WSW Components
RFQ

Min: 1

Mult: 1

0 0x0x0 Tube PLCC - download Assmann WSW Components Closed Frame A-CCS 04 1 A -40°C ~ 105°C Through Hole Solder UL94 V-0 44 (4 x 11) Polybutylene Terephthalate (PBT) Active 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze 0.100" (2.54mm) Tin 160.0µin (4.06µm) Phosphor Bronze 0.132" (3.35mm) 15mOhm
A-CCS 068-Z-T A-CCS 068-Z-T Assmann WSW Components
RFQ

Min: 1

Mult: 1

0 0x0x0 Tube PLCC - download Assmann WSW Components Closed Frame A-CCS 06 1 A -40°C ~ 105°C Through Hole Solder UL94 V-0 68 (4 x 17) Polybutylene Terephthalate (PBT) Active 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze 0.100" (2.54mm) Tin 160.0µin (4.06µm) Phosphor Bronze 0.132" (3.35mm) 15mOhm
A-CCS 052-G-T A-CCS 052-G-T Assmann WSW Components
RFQ

Min: 1

Mult: 1

0 0x0x0 Tube PLCC - download Assmann WSW Components Closed Frame A-CCS 05 1 A -40°C ~ 105°C Through Hole Solder UL94 V-0 52 (4 x 13) Polybutylene Terephthalate (PBT) Active 0.050" (1.27mm) Gold - Phosphor Bronze 0.100" (2.54mm) Gold - Phosphor Bronze 0.132" (3.35mm) 15mOhm
940-44-020-24-000000 940-44-020-24-000000 Mill-Max Manufacturing Corp.
RFQ

Min: 1

Mult: 1

0 0x0x0 Tube PLCC 940 download Mill-Max Manufacturing Corp. Closed Frame 940-44 1 A -55°C ~ 125°C Through Hole Solder UL94 V-0 20 (4 x 5) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Active 0.100" (2.54mm) Tin 150.0µin (3.81µm) Beryllium Copper 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy 0.130" (3.30mm) 30mOhm
940-44-068-24-000000 940-44-068-24-000000 Mill-Max Manufacturing Corp.
RFQ

Min: 1

Mult: 1

0 0x0x0 Tube PLCC 940 download Mill-Max Manufacturing Corp. Closed Frame 940-44 1 A -55°C ~ 125°C Through Hole Solder UL94 V-0 68 (4 x 17) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Active 0.100" (2.54mm) Tin 150.0µin (3.81µm) Beryllium Copper 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy 0.130" (3.30mm) 30mOhm
940-44-028-17-400000 940-44-028-17-400000 Mill-Max Manufacturing Corp.
RFQ

Min: 1

Mult: 1

0 0x0x0 Tube PLCC 940 download Mill-Max Manufacturing Corp. Closed Frame 940-44 1 A -55°C ~ 125°C Surface Mount Solder UL94 V-0 28 (4 x 7) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Active 0.050" (1.27mm) Tin 150.0µin (3.81µm) Beryllium Copper 0.050" (1.27mm) Tin 200.0µin (5.08µm) Brass Alloy - 30mOhm
940-44-032-17-400000 940-44-032-17-400000 Mill-Max Manufacturing Corp.
RFQ

Min: 1

Mult: 1

0 0x0x0 Tube PLCC 940 download Mill-Max Manufacturing Corp. Closed Frame 940-44 1 A -55°C ~ 125°C Surface Mount Solder UL94 V-0 32 (2 x 7, 2 x 9) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Active 0.050" (1.27mm) Tin 150.0µin (3.81µm) Beryllium Copper 0.050" (1.27mm) Tin 200.0µin (5.08µm) Brass Alloy - 30mOhm
540-44-044-17-400000 540-44-044-17-400000 Mill-Max Manufacturing Corp.
RFQ

Min: 1

Mult: 1

0 0x0x0 Tube PLCC 540 download Mill-Max Manufacturing Corp. Closed Frame 540-44 -55°C ~ 125°C Surface Mount Solder UL94 V-0 44 (4 x 11) Polyphenylene Sulfide (PPS) Active 0.050" (1.27mm) Tin 150.0µin (3.81µm) Copper Alloy 0.050" (1.27mm) Tin 150.0µin (3.81µm) Copper Alloy - 20mOhm
110-43-314-41-001000 110-43-314-41-001000 Mill-Max Manufacturing Corp.
RFQ

Min: 1

Mult: 1

0 0x0x0 Tube DIP, 0.3" (7.62mm) Row Spacing 110 download Mill-Max Manufacturing Corp. Open Frame 110-43 3 A -55°C ~ 125°C Through Hole Solder - 14 (2 x 7) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Active 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy 0.125" (3.18mm) -
110-43-324-41-001000 110-43-324-41-001000 Mill-Max Manufacturing Corp.
RFQ

Min: 1

Mult: 1

0 0x0x0 Tube DIP, 0.3" (7.62mm) Row Spacing 110 download Mill-Max Manufacturing Corp. Open Frame 110-43 3 A -55°C ~ 125°C Through Hole Solder - 24 (2 x 12) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Active 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy 0.125" (3.18mm) -
110-43-640-41-001000 110-43-640-41-001000 Mill-Max Manufacturing Corp.
RFQ

Min: 1

Mult: 1

0 0x0x0 Tube DIP, 0.6" (15.24mm) Row Spacing 110 download Mill-Max Manufacturing Corp. Open Frame 110-43 3 A -55°C ~ 125°C Through Hole Solder - 40 (2 x 20) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Active 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy 0.125" (3.18mm) -
110-43-964-41-001000 110-43-964-41-001000 Mill-Max Manufacturing Corp.
RFQ

Min: 1

Mult: 1

0 0x0x0 Tube DIP, 0.9" (22.86mm) Row Spacing 110 download Mill-Max Manufacturing Corp. Open Frame 110-43 3 A -55°C ~ 125°C Through Hole Solder - 64 (2 x 32) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Active 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy 0.125" (3.18mm) -

Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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