CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

XP3A-7583-0825D-D/S

Manufacturer No:

339

Quantity:

9999

Model:

default

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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XP3A-7583-0825D-D/S

CONTACT SPRING LOADED T/H GOLD

  • Type
    Parameter
    Select All
  • Mfr

    Omron Electronics Inc-EMC Div

  • Series

    XP3A

  • Package

    -

  • Product Status

    Obsolete

  • Contact Type

    Probe Pin

  • Mounting Type

    Through Hole

  • Maximum Working Height

    0.096" (2.45mm)

  • Recommended Working Height

    0.085" (2.15mm)

  • Minimum Working Height

    -

  • Pad Layout Dimension

    -

  • Operating Force - Initial

    15gf

  • Operating Force - Mid Compression

    -

  • Plunger Size

    0.003" ~ 0.030" (0.08mm ~ 0.75mm)

  • Features

    -

  • Mating Cycles

    -

  • Contact Material

    Nickel Alloy

  • Contact Finish

    Gold

  • Contact Finish Thickness

    40.0µin (1.02µm)

  • Current Rating (Amps)

    0.25A

  • Material Flammability Rating

    -

  • Operating Temperature

    -25°C ~ 85°C

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

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    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

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  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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