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Home Product, Material Handling and Storage - Storage Containers and Bins RF Shield Kits XCZU1EG-L2SFVA625E

XCZU1EG-L2SFVA625E

Manufacturer No:

1110

Manufacturer:

AMD Xilinx

Quantity:

9999

Model:

default

Datasheet:

XCZU1EG-L2SFVA625E

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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XCZU1EG-L2SFVA625E

IC ZUP MPSOC LP A53 FPGA 625BGA

  • Type
    Parameter
    Select All

  • Mfr

    AMD Xilinx

  • Series

    Zynq® UltraScale+™

  • Package

    Tray

  • Product Status

    Active

  • Architecture

    MPU, FPGA

  • Core Processor

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

  • Flash Size

    -

  • RAM Size

    256KB

  • Peripherals

    DMA, WDT

  • Connectivity

    -

  • Speed

    533MHz, 600MHz, 1.333GHz

  • Primary Attributes

    -

  • Operating Temperature

    0°C ~ 100°C (TJ)

  • Package / Case

    625-BFBGA, FCBGA

  • Supplier Device Package

    625-FCBGA (21x21)

  • Number of I/O

    -

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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