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Home Product, Material Handling and Storage - Storage Containers and Bins Outdoor Products - Cans, Trash Cans and Covers XC3S400-4FGG456C

XC3S400-4FGG456C

Manufacturer No:

1110

Manufacturer:

AMD Xilinx

Quantity:

9999

Model:

default

Datasheet:

XC3S400-4FGG456C

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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XC3S400-4FGG456C

IC FPGA 264 I/O 456FBGA

  • Type
    Parameter
    Select All

  • Mfr

    AMD Xilinx

  • Series

    Spartan®-3

  • Package

    Tray

  • Product Status

    Active

  • Number of LABs/CLBs

    896

  • Number of Logic Elements/Cells

    8064

  • Total RAM Bits

    294912

  • Number of I/O

    264

  • Number of Gates

    400000

  • Voltage - Supply

    1.14V ~ 1.26V

  • Mounting Type

    Surface Mount

  • Operating Temperature

    0°C ~ 85°C (TJ)

  • Package / Case

    456-BBGA

  • Supplier Device Package

    456-FBGA (23x23)

  • Base Product Number

    XC3S400

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

  • Manufacturer No:

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  • Manufacturer No:

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  • Manufacturer No:

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  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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