CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

TPA112DR

Manufacturer No:

28

Manufacturer:

Texas Instruments

Quantity:

9999

Model:

default

Datasheet:

TPA112DR

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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TPA112DR

IC AMP CLASS AB STER 70MW 8SOIC

  • Type
    Parameter
    Select All
  • Mfr

    Texas Instruments

  • Series

    -

  • Package

    Tape & Reel (TR)

  • Product Status

    Active

  • Type

    Class AB

  • Output Type

    Headphones, 2-Channel (Stereo)

  • Max Output Power x Channels @ Load

    70mW x 2 @ 8Ohm

  • Voltage - Supply

    2.5V ~ 5.5V

  • Features

    Depop, Short-Circuit and Thermal Protection

  • Mounting Type

    Surface Mount

  • Operating Temperature

    -40°C ~ 85°C (TA)

  • Supplier Device Package

    8-SOIC

  • Package / Case

    8-SOIC (0.154", 3.90mm Width)

  • Base Product Number

    TPA112

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