CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

TE0820-02-03EG-1EA

Manufacturer No:

1128

Manufacturer:

Trenz Electronic GmbH

Quantity:

9999

Model:

default

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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TE0820-02-03EG-1EA

IC MODULE ZYNQ USCALE 1GB 128MB

  • Type
    Parameter
    Select All
  • Mfr

    Trenz Electronic GmbH

  • Series

    TE0820

  • Package

    Bulk

  • Product Status

    Obsolete

  • Module/Board Type

    MPU Core

  • Core Processor

    Zynq UltraScale+ XCZU3EG-1SFVC784E

  • Co-Processor

    -

  • Speed

    -

  • Flash Size

    128MB

  • RAM Size

    1GB

  • Connector Type

    B2B

  • Size / Dimension

    1.970" L x 1.570" W (50.00mm x 40.00mm)

  • Operating Temperature

    0°C ~ 85°C

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

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  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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