CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

SA10BM331A19R09XXX

Manufacturer No:

3766

Quantity:

9999

Model:

default

Datasheet:

-

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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SA10BM331A19R09XXX

H-CHIP D-CASE ALUMINUM POLYMER

  • Type
    Parameter
    Select All
  • Mfr

    Aishi Capacitors (Hunan Aihua Group

  • Series

    A1

  • Package

    Tape & Reel (TR)

  • Product Status

    Active

  • Type

    Polymer

  • Capacitance

    330 µF

  • Tolerance

    ±20%

  • Voltage - Rated

    2 V

  • ESR (Equivalent Series Resistance)

    9mOhm

  • Lifetime @ Temp.

    2000 Hrs @ 105°C

  • Operating Temperature

    -55°C ~ 105°C

  • Ratings

    -

  • Applications

    General Purpose

  • Ripple Current @ High Frequency

    3.5 A @ 100 kHz

  • Lead Spacing

    -

  • Size / Dimension

    0.287" L x 0.169" W (7.30mm x 4.30mm)

  • Height - Seated (Max)

    0.079" (2.00mm)

  • Surface Mount Land Size

    -

  • Mounting Type

    Surface Mount

  • Package / Case

    2917 (7343 Metric)

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Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

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  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

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  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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