CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

RM3X4MM 2701

Manufacturer No:

672

Manufacturer:

APM Hexseal

Quantity:

9999

Model:

default

Datasheet:

RM3X4MM 2701

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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RM3X4MM 2701

MACH SCREW PAN HEAD PHILLIPS M3

  • Type
    Parameter
    Select All
  • Mfr

    APM Hexseal

  • Series

    SEELSKREW®

  • Package

    Bulk

  • Product Status

    Active

  • Type

    Machine Screw

  • Screw Head Type

    Pan Head

  • Drive Type

    Phillips

  • Features

    Self Sealing

  • Thread Size

    M3

  • Head Diameter

    0.264" (6.70mm)

  • Head Height

    0.094" (2.40mm)

  • Length - Below Head

    0.157" (4.00mm)

  • Length - Overall

    0.250" (6.35mm) 1/4"

  • Material

    Stainless Steel

  • Plating

    -

  • Base Product Number

    RM3

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

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  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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