CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

PAC1954T-E/4MXVAO

Manufacturer No:

14

Manufacturer:

Microchip Technology

Quantity:

9999

Model:

default

Datasheet:

PAC1954T-E/4MXVAO

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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PAC1954T-E/4MXVAO

QUAD HIGH-SIDE CURRENT SENSOR, I

  • Type
    Parameter
    Select All
  • Mfr

    Microchip Technology

  • Series

    -

  • Package

    Tape & Reel (TR)

  • Product Status

    Active

  • Function

    Current Monitor

  • Sensing Method

    High-Side

  • Accuracy

    ±1%

  • Voltage - Input

    2.7V ~ 5.5V

  • Current - Output

    100mA

  • Operating Temperature

    -40°C ~ 125°C (TA)

  • Mounting Type

    Surface Mount, Wettable Flank

  • Package / Case

    16-VFQFN Exposed Pad

  • Supplier Device Package

    16-VQFN (3x3)

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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