CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

NVT2008BQ,115

Manufacturer No:

156

Manufacturer:

NXP USA Inc.

Quantity:

9999

Model:

default

Datasheet:

NVT2008BQ,115

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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NVT2008BQ,115

IC TRANSLATOR BIDIR 20DHVQFN

  • Type
    Parameter
    Select All
  • Mfr

    NXP USA Inc.

  • Series

    -

  • Package

    Tape & Reel (TR)

  • Product Status

    Active

  • Translator Type

    Voltage Level

  • Channel Type

    Bidirectional

  • Number of Circuits

    1

  • Channels per Circuit

    8

  • Voltage - VCCA

    1 V ~ 3.6 V

  • Voltage - VCCB

    1.8 V ~ 5.5 V

  • Input Signal

    -

  • Output Signal

    -

  • Output Type

    Open Drain, Push-Pull

  • Data Rate

    -

  • Operating Temperature

    -40°C ~ 85°C (TA)

  • Features

    Auto-Direction Sensing

  • Mounting Type

    Surface Mount

  • Package / Case

    20-VFQFN Exposed Pad

  • Supplier Device Package

    20-DHVQFN (4.5x2.5)

  • Base Product Number

    NVT2008

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