CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

NE1619DS,112

Manufacturer No:

156

Manufacturer:

NXP USA Inc.

Quantity:

9999

Model:

default

Datasheet:

NE1619DS,112

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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NE1619DS,112

IC TEMP MONITOR 16SSOP

  • Type
    Parameter
    Select All
  • Mfr

    NXP USA Inc.

  • Series

    -

  • Package

    Tube

  • Product Status

    Obsolete

  • Function

    Temp Monitoring System (Sensor)

  • Sensor Type

    Internal and External

  • Sensing Temperature

    0°C ~ 125°C, External Sensor

  • Accuracy

    ±3°C Local(Max), ±5°C Remote(Max)

  • Topology

    ADC, Multiplexer, Register Bank

  • Output Type

    SMBus

  • Output Alarm

    Yes

  • Output Fan

    No

  • Voltage - Supply

    2.8V ~ 5.5V

  • Operating Temperature

    0°C ~ 125°C

  • Mounting Type

    Surface Mount

  • Package / Case

    16-SSOP (0.154", 3.90mm Width)

  • Supplier Device Package

    16-SSOP

  • Base Product Number

    NE161

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