CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

MPF5023AMMA0ES

Manufacturer No:

156

Manufacturer:

NXP USA Inc.

Quantity:

9999

Model:

default

Datasheet:

-

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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MPF5023AMMA0ES

POWER MANAGEMENT IC, PRE-PROG, 3

  • Type
    Parameter
    Select All
  • Mfr

    NXP USA Inc.

  • Series

    -

  • Package

    Tray

  • Product Status

    Active

  • Applications

    High Performance i.MX 8, S32x Processor Based

  • Current - Supply

    10µA

  • Voltage - Supply

    2.5V ~ 5.5V

  • Operating Temperature

    -40°C ~ 125°C (TA)

  • Mounting Type

    Surface Mount, Wettable Flank

  • Package / Case

    40-VFQFN Exposed Pad

  • Supplier Device Package

    40-HVQFN (6x6)

  • Base Product Number

    MPF5023

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