CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

MMF006630

Manufacturer No:

1329

Quantity:

9999

Model:

default

Datasheet:

MMF006630

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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MMF006630

1240-FPA SILVER SOLDER PASTE --

  • Type
    Parameter
    Select All
  • Mfr

    Micro-Measurements (Division of Vishay Precision Group)

  • Series

    -

  • Package

    Jar

  • Product Status

    Active

  • Type

    Solder Paste

  • Composition

    Ag40Cu30Zn28Ni2 (40/30/28/2)

  • Diameter

    -

  • Melting Point

    1220 ~ 1435°F (660 ~ 780°C)

  • Flux Type

    -

  • Wire Gauge

    -

  • Mesh Type

    -

  • Process

    Lead Free

  • Form

    Jar, 1 oz (28g)

  • Shelf Life

    9 Months

  • Shelf Life Start

    Date of Manufacture

  • Storage/Refrigeration Temperature

    41°F ~ 77°F (5°C ~ 25°C)

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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