CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

MC10XS6325EK

Manufacturer No:

156

Manufacturer:

NXP USA Inc.

Quantity:

9999

Model:

default

Datasheet:

MC10XS6325EK

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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MC10XS6325EK

IC PWR SWITCH HIGH SIDE 32HSOP

  • Type
    Parameter
    Select All
  • Mfr

    NXP USA Inc.

  • Series

    -

  • Package

    Tube

  • Product Status

    Obsolete

  • Switch Type

    General Purpose

  • Number of Outputs

    3

  • Ratio - Input:Output

    -

  • Output Configuration

    High Side

  • Output Type

    -

  • Interface

    SPI

  • Voltage - Load

    7V ~ 18V

  • Voltage - Supply (Vcc/Vdd)

    4.5V ~ 5.5V

  • Current - Output (Max)

    3.8A, 9A

  • Rds On (Typ)

    10mOhm, 25mOhm

  • Input Type

    -

  • Features

    Status Flag

  • Fault Protection

    Open Load Detect, Over Temperature

  • Operating Temperature

    -40°C ~ 125°C (TA)

  • Mounting Type

    Surface Mount

  • Supplier Device Package

    32-HSOP

  • Package / Case

    32-SSOP (0.295", 7.50mm Width) Exposed Pad

  • Base Product Number

    MC10X

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