CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

LX60-20S

Manufacturer No:

561

Manufacturer:

Hirose Electric Co Ltd

Quantity:

9999

Model:

default

Datasheet:

LX60-20S

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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LX60-20S

CONN RCPT 20P 0.02 GOLD SMD R/A

  • Type
    Parameter
    Select All
  • Voltage Rating

    50VAC

  • Applications

    General Purpose, Telecommunications

  • Insulation Material

    Polyamide (PA9T), Nylon 9T

  • Contact Shape

    -

  • Contact Material

    Copper Alloy

  • Contact Finish Thickness - Post

    Flash

  • Base Product Number

    LX60

  • Mfr

    Hirose Electric Co Ltd

  • Series

    LX

  • Package

    Tape & Reel (TR)

  • Product Status

    Active

  • Connector Type

    Receptacle

  • Contact Type

    Center Strip Contact

  • Style

    Board to Cable/Wire

  • Number of Positions

    20

  • Number of Positions Loaded

    All

  • Pitch - Mating

    0.020" (0.50mm)

  • Number of Rows

    1

  • Row Spacing - Mating

    -

  • Mounting Type

    Surface Mount, Right Angle

  • Termination

    Solder

  • Fastening Type

    Friction Lock

  • Contact Finish - Mating

    Gold

  • Contact Finish Thickness - Mating

    12.0µin (0.30µm)

  • Insulation Color

    Black

  • Insulation Height

    0.079" (2.00mm)

  • Contact Length - Post

    -

  • Operating Temperature

    -40°C ~ 70°C

  • Material Flammability Rating

    UL94 V-0

  • Contact Finish - Post

    Gold

  • Mated Stacking Heights

    -

  • Ingress Protection

    -

  • Features

    Board Guide

  • Current Rating (Amps)

    0.5A

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