CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

HM2P09PDS1J0N9LF

Manufacturer No:

128

Manufacturer:

Amphenol ICC (FCI)

Quantity:

9999

Model:

default

Datasheet:

HM2P09PDS1J0N9LF

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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HM2P09PDS1J0N9LF

CONN HEADER 55POS 2MM PRESS-FIT

  • Type
    Parameter
    Select All
  • Mfr

    Amphenol ICC (FCI)

  • Series

    Millipacs®

  • Package

    Tray

  • Product Status

    Active

  • Connector Type

    Header, Male Pins

  • Connector Style

    C 11

  • Number of Positions

    55

  • Number of Positions Loaded

    All

  • Pitch

    0.079" (2.00mm)

  • Number of Rows

    5

  • Mounting Type

    Through Hole

  • Termination

    Press-Fit

  • Connector Usage

    -

  • Contact Finish

    Gold

  • Contact Finish Thickness

    Flash

  • Current Rating (Amps)

    1.5 A

  • Voltage Rating

    750Vrms

  • Operating Temperature

    -55°C ~ 125°C

  • Features

    Board Guide

  • Base Product Number

    HM2P09

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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