CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

HC5513BIM

Manufacturer No:

422

Quantity:

9999

Model:

default

Datasheet:

HC5513BIM

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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HC5513BIM

IC TELECOM INTERFACE 22DIP

  • Type
    Parameter
    Select All
  • Mfr

    Renesas Electronics America Inc

  • Series

    UniSLIC14

  • Package

    Tube

  • Product Status

    Obsolete

  • Function

    Subscriber Line Interface Concept (SLIC)

  • Interface

    -

  • Number of Circuits

    1

  • Voltage - Supply

    -

  • Current - Supply

    2.25mA

  • Power (Watts)

    1.5 W

  • Operating Temperature

    -40°C ~ 85°C

  • Mounting Type

    Through Hole

  • Package / Case

    22-DIP (0.400", 10.16mm)

  • Supplier Device Package

    22-PDIP

  • Base Product Number

    HC5513

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