CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

FK22C0G2J223J

Manufacturer No:

165

Manufacturer:

TDK Corporation

Quantity:

9999

Model:

default

Datasheet:

FK22C0G2J223J

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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FK22C0G2J223J

CAP CER 0.022UF 630V C0G RADIAL

  • Type
    Parameter
    Select All
  • Mfr

    TDK Corporation

  • Series

    FK

  • Package

    Bulk

  • Product Status

    Not For New Designs

  • Capacitance

    0.022 µF

  • Tolerance

    ±5%

  • Voltage - Rated

    630V

  • Temperature Coefficient

    C0G, NP0

  • Operating Temperature

    -55°C ~ 125°C

  • Features

    -

  • Ratings

    -

  • Applications

    General Purpose

  • Failure Rate

    -

  • Mounting Type

    Through Hole

  • Package / Case

    Radial

  • Size / Dimension

    0.295" L x 0.157" W (7.50mm x 4.00mm)

  • Height - Seated (Max)

    0.315" (8.00mm)

  • Thickness (Max)

    -

  • Lead Spacing

    0.197" (5.00mm)

  • Lead Style

    Formed Leads - Kinked

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