CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

FHV-3AN

Manufacturer No:

165

Manufacturer:

TDK Corporation

Quantity:

9999

Model:

default

Datasheet:

FHV-3AN

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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FHV-3AN

CAP CER 5200PF 20KV Y5S DISK

  • Type
    Parameter
    Select All
  • Mfr

    TDK Corporation

  • Series

    FHV

  • Package

    Bulk

  • Product Status

    Active

  • Capacitance

    5200 pF

  • Tolerance

    ±10%

  • Voltage - Rated

    20000V (20kV)

  • Temperature Coefficient

    Y5S

  • Operating Temperature

    -30°C ~ 85°C

  • Features

    High Voltage, Low Dissipation Factor

  • Ratings

    -

  • Applications

    General Purpose

  • Failure Rate

    -

  • Mounting Type

    Requires Holder

  • Package / Case

    Disk, Metal Fitting - Threaded

  • Size / Dimension

    2.362" Dia x 0.886" L (60.00mm x 22.50mm)

  • Height - Seated (Max)

    -

  • Thickness (Max)

    -

  • Lead Spacing

    -

  • Lead Style

    -

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