CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

DF4-3PA-2R28

Manufacturer No:

561

Manufacturer:

Hirose Electric Co Ltd

Quantity:

9999

Model:

default

Datasheet:

DF4-3PA-2R28

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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DF4-3PA-2R28

CONN WIRE IDC 3POS 28AWG PCB RA

  • Type
    Parameter
    Select All
  • Mfr

    Hirose Electric Co Ltd

  • Series

    DF4

  • Package

    Bulk

  • Product Status

    Obsolete

  • Connector Type

    Individual Wires

  • Number of Positions

    3

  • Cable Pitch

    0.079" (2.00mm)

  • Board-Side Pitch

    0.079" (2.00mm)

  • Number of Rows

    1

  • Row Spacing

    -

  • Mounting Type

    Through Hole, Right Angle

  • Cable Termination

    IDC

  • Wire Gauge

    28 AWG, Stranded

  • Features

    Closed End

  • Contact Finish

    Tin

  • Contact Finish Thickness

    -

  • Color

    Black

  • Number of Positions Loaded

    All

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