CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

CL05X106MR5NUNC

Manufacturer No:

905

Quantity:

9999

Model:

default

Datasheet:

CL05X106MR5NUNC

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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CL05X106MR5NUNC

CAP CER 10UF 4V X6S 0402

  • Type
    Parameter
    Select All
  • Mfr

    Samsung Electro-Mechanics

  • Series

    CL

  • Package

    Tape & Reel (TR)

  • Product Status

    Active

  • Capacitance

    10 µF

  • Tolerance

    ±20%

  • Voltage - Rated

    4V

  • Temperature Coefficient

    X6S

  • Operating Temperature

    -55°C ~ 105°C

  • Features

    -

  • Ratings

    -

  • Applications

    General Purpose

  • Failure Rate

    -

  • Mounting Type

    Surface Mount, MLCC

  • Package / Case

    0402 (1005 Metric)

  • Size / Dimension

    0.039" L x 0.020" W (1.00mm x 0.50mm)

  • Height - Seated (Max)

    -

  • Thickness (Max)

    0.028" (0.70mm)

  • Lead Spacing

    -

  • Lead Style

    -

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

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    PIC1 8F24J11T-/SS

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  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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