CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

CGA3E1X7R0J225K080AC

Manufacturer No:

165

Manufacturer:

TDK Corporation

Quantity:

9999

Model:

default

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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CGA3E1X7R0J225K080AC

CAP CER 2.2UF 6.3V X7R 0603

  • Type
    Parameter
    Select All
  • Voltage - Rated

    6.3V

  • Temperature Coefficient

    X7R

  • Operating Temperature

    -55°C ~ 125°C

  • Features

    -

  • Ratings

    AEC-Q200

  • Applications

    Automotive

  • Failure Rate

    -

  • Mounting Type

    Surface Mount, MLCC

  • Package / Case

    0603 (1608 Metric)

  • Size / Dimension

    0.063" L x 0.031" W (1.60mm x 0.80mm)

  • Height - Seated (Max)

    -

  • Thickness (Max)

    0.035" (0.90mm)

  • Lead Spacing

    -

  • Lead Style

    -

  • Mfr

    TDK Corporation

  • Series

    CGA

  • Package

    Tape & Reel (TR)

  • Product Status

    Active

  • Capacitance

    2.2 µF

  • Tolerance

    ±10%

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