CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

C7563X7R1E476M230LE

Manufacturer No:

165

Manufacturer:

TDK Corporation

Quantity:

9999

Model:

default

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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C7563X7R1E476M230LE

CAP CER 47UF 25V X7R SMD

  • Type
    Parameter
    Select All
  • Mfr

    TDK Corporation

  • Series

    C

  • Package

    Tape & Reel (TR)

  • Product Status

    Active

  • Capacitance

    47 µF

  • Tolerance

    ±20%

  • Voltage - Rated

    25V

  • Temperature Coefficient

    X7R

  • Operating Temperature

    -55°C ~ 125°C

  • Features

    Soft Termination

  • Ratings

    -

  • Applications

    Boardflex Sensitive

  • Failure Rate

    -

  • Mounting Type

    Surface Mount, MLCC

  • Package / Case

    3025 (7563 Metric)

  • Size / Dimension

    0.295" L x 0.248" W (7.50mm x 6.30mm)

  • Height - Seated (Max)

    -

  • Thickness (Max)

    0.102" (2.60mm)

  • Lead Spacing

    -

  • Lead Style

    -

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