CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

C2012X6S1A226M125AC

Manufacturer No:

165

Manufacturer:

TDK Corporation

Quantity:

9999

Model:

default

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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C2012X6S1A226M125AC

CAP CER 22UF 10V X6S 0805

  • Type
    Parameter
    Select All
  • Mfr

    TDK Corporation

  • Series

    C

  • Package

    Tape & Reel (TR)

  • Product Status

    Active

  • Capacitance

    22 µF

  • Tolerance

    ±20%

  • Voltage - Rated

    10V

  • Temperature Coefficient

    X6S

  • Operating Temperature

    -55°C ~ 105°C

  • Features

    Low ESL

  • Ratings

    -

  • Applications

    General Purpose

  • Failure Rate

    -

  • Mounting Type

    Surface Mount, MLCC

  • Package / Case

    0805 (2012 Metric)

  • Size / Dimension

    0.079" L x 0.049" W (2.00mm x 1.25mm)

  • Height - Seated (Max)

    -

  • Thickness (Max)

    0.057" (1.45mm)

  • Lead Spacing

    -

  • Lead Style

    -

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