CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

C0810J5003AHF

Manufacturer No:

1197

Manufacturer:

TTM Technologies, Inc.

Quantity:

9999

Model:

default

Datasheet:

C0810J5003AHF

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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C0810J5003AHF

RF DIR COUPLER 800MHZ-1GHZ 0805

  • Type
    Parameter
    Select All
  • Coupling Factor

    3dB

  • Applications

    CDMA, WCDMA

  • Insertion Loss

    0.5dB

  • Power - Max

    4W

  • Isolation

    23dB

  • Return Loss

    31dB

  • Package / Case

    0805 (2012 Metric)

  • Supplier Device Package

    0805 (2012 Metric)

  • Base Product Number

    C0810

  • Mfr

    TTM Technologies, Inc.

  • Series

    Xinger®

  • Package

    Tape & Reel (TR)

  • Product Status

    Active

  • Coupler Type

    Standard

  • Frequency

    800MHz ~ 1GHz

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

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    PIC1 8F24J11T-/SS

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  • Manufacturer No:

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  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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