CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

BU97930MUV-BZE2

Manufacturer No:

13

Manufacturer:

Rohm Semiconductor

Quantity:

9999

Model:

default

Datasheet:

BU97930MUV-BZE2

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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BU97930MUV-BZE2

IC DRVR 108 SEGMNT VQFN040-V6060

  • Type
    Parameter
    Select All
  • Package / Case

    40-VFQFN Exposed Pad

  • Supplier Device Package

    VQFN040V6060

  • Mfr

    Rohm Semiconductor

  • Series

    -

  • Package

    Tape & Reel (TR)

  • Product Status

    Obsolete

  • Display Type

    LCD

  • Configuration

    108 Segment

  • Interface

    3-Wire Serial

  • Digits or Characters

    -

  • Voltage - Supply

    1.8V ~ 3.6V

  • Operating Temperature

    -40°C ~ 85°C

  • Mounting Type

    Surface Mount

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

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    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

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  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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