CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

BGS12P2L6E6327XTSA1

Manufacturer No:

278

Manufacturer:

Infineon Technologies

Quantity:

9999

Model:

default

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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BGS12P2L6E6327XTSA1

CMOS SWITCH

  • Type
    Parameter
    Select All
  • Mfr

    Infineon Technologies

  • Series

    -

  • Package

    Tape & Reel (TR)

  • Product Status

    Active

  • RF Type

    GSM, LTE, W-CDMA

  • Topology

    -

  • Circuit

    SPDT

  • Frequency Range

    50MHz ~ 6GHz

  • Isolation

    27dB

  • Insertion Loss

    0.51dB

  • Test Frequency

    5.925GHz

  • P1dB

    -

  • IIP3

    74dBm

  • Features

    -

  • Impedance

    50Ohm

  • Voltage - Supply

    1.65V ~ 3.4V

  • Operating Temperature

    -40°C ~ 85°C (TA)

  • Package / Case

    6-XFDFN

  • Supplier Device Package

    PG-TSLP-6-4

  • Base Product Number

    BGS12P2

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    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Description:

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