CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

BD7602GUL-E2

Manufacturer No:

13

Manufacturer:

Rohm Semiconductor

Quantity:

9999

Model:

default

Datasheet:

BD7602GUL-E2

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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BD7602GUL-E2

IC REG LDO NFC 2OUT 9-VCSP50L1C

  • Type
    Parameter
    Select All
  • Mfr

    Rohm Semiconductor

  • Series

    -

  • Package

    Tape & Reel (TR)

  • Product Status

    Active

  • Applications

    LDO, NFC

  • Voltage - Input

    2.7V ~ 5.5V

  • Number of Outputs

    2

  • Voltage - Output

    3V, 2.8V ~ 3.3V

  • Operating Temperature

    -35°C ~ 85°C

  • Mounting Type

    Surface Mount

  • Package / Case

    9-UFBGA, CSPBGA

  • Supplier Device Package

    9-VCSP50L1C (1.6x1.6)

  • Base Product Number

    BD7602

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