CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

B66501G0000X187

Manufacturer No:

106

Manufacturer:

EPCOS - TDK Electronics

Quantity:

9999

Model:

default

Datasheet:

B66501G0000X187

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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B66501G0000X187

FERRITE CORE ER N87 1PC

  • Type
    Parameter
    Select All
  • Mfr

    EPCOS - TDK Electronics

  • Series

    ER32/5/21

  • Package

    Tray

  • Product Status

    Active

  • Core Type

    ER

  • Supplier Device Package

    ER 32 x 5 x 21

  • Material

    N87

  • Diameter

    -

  • Tolerance

    -

  • Gap

    Ungapped

  • Finish

    Uncoated

  • Height

    0.201" (5.10mm)

  • Length

    1.260" (32.00mm)

  • Width

    0.827" (21.00mm)

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

  • Manufacturer No:

    PIC1 8F24J11T-/SS

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    PIC1 8F24J11T-/SS

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  • Description:

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