CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

B58033I5206M001

Manufacturer No:

106

Manufacturer:

EPCOS - TDK Electronics

Quantity:

9999

Model:

default

Datasheet:

B58033I5206M001

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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B58033I5206M001

CAP CER 20UF 500V 6-DIP

  • Type
    Parameter
    Select All
  • Mfr

    EPCOS - TDK Electronics

  • Series

    CeraLink™ SP

  • Package

    Tube

  • Product Status

    Active

  • Capacitance

    20 µF

  • Tolerance

    ±20%

  • Voltage - Rated

    500V

  • Temperature Coefficient

    -

  • Operating Temperature

    -40°C ~ 150°C

  • Features

    Low ESL, Low Profile, High Temperature

  • Ratings

    AEC-Q200

  • Applications

    Automotive, SMPS Filtering

  • Mounting Type

    Through Hole

  • Package / Case

    6-DIP

  • Size / Dimension

    1.299" L x 0.866" W (33.00mm x 22.00mm)

  • Height - Seated (Max)

    0.472" (12.00mm)

  • Thickness (Max)

    -

  • Lead Spacing

    -

  • Lead Style

    -

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