CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

B39202B8082P810S3

Manufacturer No:

703

Quantity:

9999

Model:

default

Datasheet:

-

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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B39202B8082P810S3

SAW DUPLEXER MOBILE SMD

  • Type
    Parameter
    Select All
  • Mfr

    Qualcomm (RF front-end (RFFE) filters)

  • Series

    -

  • Package

    Tape & Reel (TR)

  • Product Status

    Obsolete

  • Type

    Duplexer

  • Frequency Bands (Low / High)

    -

  • Low Band Attenuation (min / max dB)

    -

  • High Band Attenuation (min / max dB)

    -

  • Return Loss (Low Band / High Band)

    -

  • Mounting Type

    -

  • Package / Case

    -

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Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

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    PIC1 8F24J11T-/SS

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    PIC1 8F24J11T-/SS

  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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