CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

AS4C64M16D3LC-12BIN

Manufacturer No:

3377

Manufacturer:

Alliance Memory, Inc.

Quantity:

9999

Model:

default

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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AS4C64M16D3LC-12BIN

DDR3, 1G, 64M X 16, 1.35V, 96-BA

  • Type
    Parameter
    Select All
  • Mfr

    Alliance Memory, Inc.

  • Series

    -

  • Package

    Tray

  • Product Status

    Active

  • Memory Type

    Volatile

  • Memory Format

    DRAM

  • Technology

    SDRAM - DDR3L

  • Memory Size

    1Gbit

  • Memory Organization

    64M x 16

  • Memory Interface

    Parallel

  • Clock Frequency

    800 MHz

  • Write Cycle Time - Word, Page

    15ns

  • Access Time

    20 ns

  • Voltage - Supply

    1.283V ~ 1.45V

  • Operating Temperature

    -40°C ~ 95°C (TC)

  • Mounting Type

    Surface Mount

  • Package / Case

    96-VFBGA

  • Supplier Device Package

    96-FBGA (7.5x13)

  • Base Product Number

    AS4C64

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