CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

70-1607-0520

Manufacturer No:

1310

Manufacturer:

Kester Solder

Quantity:

9999

Model:

default

Datasheet:

70-1607-0520

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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70-1607-0520

SOLDERPASTE NO CLEAN 63/37 35GM

  • Type
    Parameter
    Select All
  • Mfr

    Kester Solder

  • Series

    R276

  • Package

    Syringe

  • Product Status

    Active

  • Type

    Solder Paste

  • Composition

    Sn63Pb37 (63/37)

  • Diameter

    -

  • Melting Point

    361°F (183°C)

  • Flux Type

    No-Clean

  • Wire Gauge

    -

  • Mesh Type

    3

  • Process

    Leaded

  • Form

    Syringe, 1.23 oz (35g), 10cc

  • Shelf Life

    6 Months

  • Shelf Life Start

    Date of Manufacture

  • Storage/Refrigeration Temperature

    32°F ~ 50°F (0°C ~ 10°C)

  • Digi-Key Storage

    Refrigerated

  • Shipping Info

    Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.

  • Weight

    0.077 lb (34.93 g)

  • Base Product Number

    70-1607

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