CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

5718L-01P-HP05

Manufacturer No:

1904

Manufacturer:

Lin Engineering

Quantity:

9999

Model:

default

Datasheet:

5718L-01P-HP05

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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5718L-01P-HP05

NEMA 23 - 3 STACK STEPPER + 5:1

  • Type
    Parameter
    Select All
  • Mfr

    Lin Engineering

  • Series

    5718

  • Package

    Box

  • Product Status

    Active

  • Type

    Hybrid

  • Coil Type

    Bipolar

  • Voltage - Rated

    24VDC

  • Steps per Revolution

    2000

  • Torque - Holding (oz-in / mNm)

    1,470 / 10,400

  • Size / Dimension

    Square - 2.25" x 2.25" (57.20mm x 57.20mm)

  • NEMA Frame Size

    23

  • Diameter - Shaft

    0.63" (16mm)

  • Length - Shaft and Bearing

    1.16" (29.5mm)

  • Mounting Hole Spacing

    1.949" (49.50mm)

  • Termination Style

    Wire Leads

  • Operating Temperature

    -20°C ~ 50°C

  • Coil Resistance

    1.1 Ohms

  • Features

    Shaft Key Included

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