CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

100B330JT500XT1K

Manufacturer No:

270

Quantity:

9999

Model:

default

Datasheet:

100B330JT500XT1K

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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100B330JT500XT1K

CAP CER 33PF 500V P90 1111

  • Type
    Parameter
    Select All
  • Mfr

    American Technical Ceramics

  • Series

    Porcelain Superchip® ATC 100B

  • Package

    Tape & Reel (TR)

  • Product Status

    Active

  • Capacitance

    33 pF

  • Tolerance

    ±5%

  • Voltage - Rated

    500V

  • Temperature Coefficient

    P90

  • Operating Temperature

    -55°C ~ 125°C

  • Features

    High Q, Low Loss, Low ESL

  • Ratings

    -

  • Applications

    RF, Microwave, High Frequency, Bypass, Decoupling

  • Failure Rate

    -

  • Mounting Type

    Surface Mount, MLCC

  • Package / Case

    1111 (2828 Metric)

  • Size / Dimension

    0.110" L x 0.110" W (2.79mm x 2.79mm)

  • Height - Seated (Max)

    -

  • Thickness (Max)

    0.102" (2.59mm)

  • Lead Spacing

    -

  • Lead Style

    -

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