CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

0430450411

Manufacturer No:

23

Manufacturer:

Molex

Quantity:

9999

Model:

default

Datasheet:

0430450411

In Stock

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7019BG
7019BG Aavid, Thermal Division of Boyd Corporation AAVID THERMALLOY 7019BG HEAT SINK

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0430450411

CONN HEADER SMD R/A 4POS 3MM

  • Type
    Parameter
    Select All
  • Contact Material

    Brass

  • Insulation Material

    Liquid Crystal Polymer (LCP), Glass Filled

  • Features

    Solder Retention

  • Operating Temperature

    -40°C ~ 105°C

  • Ingress Protection

    -

  • Material Flammability Rating

    UL94 V-0

  • Insulation Color

    Black

  • Current Rating (Amps)

    8A

  • Voltage Rating

    600V

  • Mated Stacking Heights

    -

  • Contact Finish Thickness - Post

    100.0µin (2.54µm)

  • Applications

    General Purpose, Medical, Military, Telecommunications

  • Base Product Number

    043045

  • Mfr

    Molex

  • Series

    Micro-Fit 3.0 43045

  • Package

    Tape & Reel (TR)

  • Product Status

    Active

  • Connector Type

    Header

  • Contact Type

    Male Pin

  • Pitch - Mating

    0.118" (3.00mm)

  • Number of Positions

    4

  • Number of Rows

    2

  • Row Spacing - Mating

    0.118" (3.00mm)

  • Number of Positions Loaded

    All

  • Style

    Board to Cable/Wire

  • Shrouding

    Shrouded - 4 Wall

  • Mounting Type

    Surface Mount, Right Angle

  • Termination

    Solder

  • Fastening Type

    Locking Ramp

  • Contact Length - Mating

    -

  • Contact Length - Post

    -

  • Overall Contact Length

    -

  • Insulation Height

    0.290" (7.37mm)

  • Contact Shape

    Square

  • Contact Finish - Mating

    Gold

  • Contact Finish Thickness - Mating

    30.0µin (0.76µm)

  • Contact Finish - Post

    Tin

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