CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

Compare Image Name Manufacturer Quantity Weight(Kg) Size(LxWxH) Color Package Series Datasheet Mfr Features Base Product Number Current Rating (Amps) Operating Temperature Contact Finish Mounting Type Contact Finish Thickness Connector Type Number of Positions Number of Rows Connector Style Termination Material Flammability Rating Pitch Voltage Rating Product Status Number of Positions Loaded Connector Usage Number of Columns Contact Layout, Typical
532428-9 532428-9 TE Connectivity AMP Connectors
RFQ

Min: 1

Mult: 1

0 0x0x0 Natural Tube HDI (High Density Interconnect) download TE Connectivity AMP Connectors Mating Guide 532428 - -65°C ~ 125°C Gold Through Hole, Right Angle 30.0µin (0.76µm) Receptacle, Female Sockets 100 2 High Density (HDC, HDI, HPC) Solder UL94 V-0 0.100" (2.54mm) - Active All - - -
532430-9 532430-9 TE Connectivity AMP Connectors
RFQ

Min: 1

Mult: 1

0 0x0x0 Natural Tube HDI (High Density Interconnect) download TE Connectivity AMP Connectors Mating Guide 532430 - -65°C ~ 125°C Gold Through Hole 30.0µin (0.76µm) Header, Male Pins 100 2 High Density (HDC, HDI, HPC) Solder UL94 V-0 0.100" (2.54mm) - Active All - - -
532446-5 532446-5 TE Connectivity AMP Connectors
RFQ

Min: 1

Mult: 1

0 0x0x0 Natural Tube HDI (High Density Interconnect) download TE Connectivity AMP Connectors Mating Guide 532446 - -65°C ~ 125°C Gold Through Hole 30.0µin (0.76µm) Header, Male Pins 60 2 High Density (HDC, HDI, HPC) Press-Fit UL94 V-0 0.100" (2.54mm) - Active All - - -
536504-2 536504-2 TE Connectivity AMP Connectors
RFQ

Min: 1

Mult: 1

0 0x0x0 Natural Tube Z-PACK download TE Connectivity AMP Connectors - 536504 - -55°C ~ 125°C Gold Through Hole - Header, Male Pins 48 4 Futurebus Press-Fit UL94 V-0 0.079" (2.00mm) 30V Active All - - -
536511-3 536511-3 TE Connectivity AMP Connectors
RFQ

Min: 1

Mult: 1

0 0x0x0 Natural Tube Z-PACK download TE Connectivity AMP Connectors Spacer 536511 - -55°C ~ 125°C Gold Board Edge, Through Hole, Right Angle - Receptacle, Female Sockets 96 4 Futurebus Press-Fit UL94 V-0 0.079" (2.00mm) 30V Obsolete All - - -
532436-1 532436-1 TE Connectivity AMP Connectors
RFQ

Min: 1

Mult: 1

0 0x0x0 Black Tube HDI (High Density Interconnect) download TE Connectivity AMP Connectors Mating Guide 532436 - -65°C ~ 125°C Gold Through Hole 30.0µin (0.76µm) Header, Male Pins 100 4 High Density (HDC, HDI, HPC) Solder UL94 V-0 0.100" (2.54mm) - Active All - - -
532434-3 532434-3 TE Connectivity AMP Connectors
RFQ

Min: 1

Mult: 1

0 0x0x0 Natural Tube HDI (High Density Interconnect) download TE Connectivity AMP Connectors Mating Guide 532434 - -65°C ~ 125°C Gold Through Hole, Right Angle 30.0µin (0.76µm) Receptacle, Female Sockets 128 4 High Density (HDC, HDI, HPC) Solder UL94 V-0 0.100" (2.54mm) - Active All - - -
532436-2 532436-2 TE Connectivity AMP Connectors
RFQ

Min: 1

Mult: 1

0 0x0x0 Black Tube HDI (High Density Interconnect) download TE Connectivity AMP Connectors Mating Guide 532436 - -65°C ~ 125°C Gold Through Hole 30.0µin (0.76µm) Header, Male Pins 120 4 High Density (HDC, HDI, HPC) Solder UL94 V-0 0.100" (2.54mm) - Active All - - -
532433-4 532433-4 TE Connectivity AMP Connectors
RFQ

Min: 1

Mult: 1

0 0x0x0 Black Tube HDI (High Density Interconnect) download TE Connectivity AMP Connectors Mating Guide 532433 - -65°C ~ 125°C Gold Through Hole 30.0µin (0.76µm) Header, Male Pins 105 3 High Density (HDC, HDI, HPC) Solder UL94 V-0 0.100" (2.54mm) - Active All - - -
532433-7 532433-7 TE Connectivity AMP Connectors
RFQ

Min: 1

Mult: 1

0 0x0x0 Black Tube HDI (High Density Interconnect) download TE Connectivity AMP Connectors Mating Guide 532433 - -65°C ~ 125°C Gold Through Hole 30.0µin (0.76µm) Header, Male Pins 150 3 High Density (HDC, HDI, HPC) Solder UL94 V-0 0.100" (2.54mm) - Active All - - -
1-532431-3 1-532431-3 TE Connectivity AMP Connectors
RFQ

Min: 1

Mult: 1

0 0x0x0 Natural Tube HDI (High Density Interconnect) download TE Connectivity AMP Connectors Mating Guide 532431 - -65°C ~ 125°C Gold Through Hole, Right Angle 30.0µin (0.76µm) Receptacle, Female Sockets 240 3 High Density (HDC, HDI, HPC) Solder UL94 V-0 0.100" (2.54mm) - Active All - - -
1-532447-2 1-532447-2 TE Connectivity AMP Connectors
RFQ

Min: 1

Mult: 1

0 0x0x0 Black Tube HDI (High Density Interconnect) download TE Connectivity AMP Connectors Mating Guide 532447 - -65°C ~ 125°C Gold Through Hole 30.0µin (0.76µm) Header, Male Pins 225 3 High Density (HDC, HDI, HPC) Press-Fit UL94 V-0 0.100" (2.54mm) - Active All - - -
1-532447-1 1-532447-1 TE Connectivity AMP Connectors
RFQ

Min: 1

Mult: 1

0 0x0x0 Black Tube HDI (High Density Interconnect) download TE Connectivity AMP Connectors Mating Guide 532447 - -65°C ~ 125°C Gold Through Hole 30.0µin (0.76µm) Header, Male Pins 210 3 High Density (HDC, HDI, HPC) Press-Fit UL94 V-0 0.100" (2.54mm) - Active All - - -
532448-3 532448-3 TE Connectivity AMP Connectors
RFQ

Min: 1

Mult: 1

0 0x0x0 Black Tube HDI (High Density Interconnect) download TE Connectivity AMP Connectors Mating Guide 532448 - -65°C ~ 125°C Gold Through Hole 30.0µin (0.76µm) Header, Male Pins 128 4 High Density (HDC, HDI, HPC) Press-Fit UL94 V-0 0.100" (2.54mm) - Active All - - -
0736561000 0736561000 Molex
RFQ

Min: 1

Mult: 1

0 0x0x0 Black Tube HDM (High Density Metric) 73656 download Molex - 73656 - -55°C ~ 105°C Gold Through Hole 30.0µin (0.76µm) Receptacle, Female Blade Sockets 3 3 HDM Press-Fit UL94 V-0 - - Active All Backplane 1 3 Power

Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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