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Blade Type Power Connectors(115)

Manufacturer

Manufacturer

  • 3M
  • Analog Devices Inc./Maxim Integrated
  • Aries Electronics
  • Logical Systems Inc.
  • MikroElektronika
  • TE Connectivity Deutsch Connectors

Packaging

Packaging

  • Bag
  • Box
  • Bulk
  • Tube

Product Status

Product Status

  • Active
  • Discontinued at Digi-Key
  • Obsolete

Series

Series

  • *
  • 647
  • Correct-A-Chip®
  • Correct-A-Chip® 1106396
  • Correct-A-Chip® 1107254
  • Correct-A-Chip® 1109252
  • Correct-A-Chip® 1109342
  • Correct-A-Chip® 1109522
  • Correct-A-Chip® 1109523
  • Correct-A-Chip® 1110087
  • Correct-A-Chip® 1110267-N
  • Correct-A-Chip® 1111163
  • Correct-A-Chip® 1111841
  • Correct-A-Chip® 1111903
  • Correct-A-Chip® 301296
  • Correct-A-Chip® 301550
  • Correct-A-Chip® 304235
  • Correct-A-Chip® 304504
  • Correct-A-Chip® 304538
  • Correct-A-Chip® 304633
  • Correct-A-Chip® 305263
  • Correct-A-Chip® 305479
  • Correct-A-Chip® 307349
  • Correct-A-Chip® 350000
  • Correct-A-Chip® 351000
  • Correct-A-Chip® 352000
  • Correct-A-Chip® 353000
  • Correct-A-Chip® 354000
  • Correct-A-Chip® 354W00
  • Correct-A-Chip® 35W000
  • Correct-A-Chip® 450001
  • Correct-A-Chip® 505
  • Correct-A-Chip® 555000
  • Correct-A-Chip® 650000
  • Correct-A-Chip® 651000
  • Correct-A-Chip® 652000
  • Correct-A-Chip® 653000
  • Correct-A-Chip® 655000
  • Correct-A-Chip® 6645
  • Correct-A-Chip® 665000
  • Correct-A-Chip® 666000
  • Correct-A-Chip® 68340
  • Correct-A-Chip® 95-132I25
  • Correct-A-Chip® 96-160M65
  • Correct-A-Chip® 96-208M50
  • Correct-A-Chip® 97-56001
  • Correct-A-Chip® 97-68340
  • Correct-A-Chip® 97-AQ132D
  • DS9075
  • Textool™

Board Material

Board Material

  • -
  • FR4 Epoxy Glass
  • Polyimide (PI)

Contact Finish - Mating

Contact Finish - Mating

  • Silver

Contact Finish - Post

Contact Finish - Post

  • Gold
  • Tin
  • Tin-Lead

Convert From (Adapter End)

Convert From (Adapter End)

  • AT90PWM1
  • AT90PWM2
  • HB2E Relay
  • MSOP
  • Multiple Packages
  • PQFP
  • SIP
  • Socket, 0.6" (15.24mm) Row Spacing
  • SOIC-W
  • SOJ
  • SSOP
  • TQFP
  • TSOP
  • VQFP

Convert To (Adapter End)

Convert To (Adapter End)

  • DIP
  • DIP, 0.3" (7.62mm) Row Spacing
  • DIP, 0.4" (10.16mm) Row Spacing
  • DIP, 0.6" (15.24mm) Row Spacing
  • DIP, 0.8" (20.32mm) Row Spacing
  • DIP, 0.9" (22.86mm) Row Spacing
  • DIP, 1.0" (25.40mm) Row Spacing
  • JEDEC
  • PGA
  • PLCC
  • QFP
  • SOIC
  • SOWIC

Housing Material

Housing Material

  • Polyamide (PA46), Nylon 4/6, Glass Filled
  • Polyester
  • Polyphenylene Sulfide (PPS)
  • Polysulfone (PSU), Glass Filled

Mounting Type

Mounting Type

  • Surface Mount
  • Through Hole

Number of Pins

Number of Pins

  • 10
  • 100
  • 12
  • 128
  • 132
  • 14
  • 144
  • 16
  • 160
  • 169
  • 18
  • 184
  • 20
  • 208
  • 22
  • 24
  • 26
  • 28
  • 32
  • 36
  • 40
  • 42
  • 44
  • 48
  • 52
  • 56
  • 60
  • 64
  • 68
  • 8
  • 80
  • 84
  • 90

Pitch - Mating

Pitch - Mating

  • 0.020" (0.50mm)
  • 0.024" (0.60mm)
  • 0.025" (0.64mm)
  • 0.026" (0.65mm)

Pitch - Post

Pitch - Post

  • 0.031" (0.80mm)
  • 0.050" (1.27mm)
  • 0.070" (1.78mm)
  • 0.100" (2.54mm)

Termination

Termination

  • Solder
  • Wire Wrap
Reset
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    Compare Image Name Manufacturer Quantity Weight(Kg) Size(LxWxH) Package Series Datasheet Mfr Features Base Product Number Current Rating (Amps) Operating Temperature Mounting Type Termination Material Flammability Rating Housing Material Convert From (Adapter End) Convert To (Adapter End) Product Status Number of Pins Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Termination Post Length Board Material
    16-354000-20 16-354000-20 Aries Electronics
    RFQ

    Min: 1

    Mult: 1

    		 0 0x0x0 Bulk Correct-A-Chip® 354000 download Aries Electronics - 16-3540 3 A - Surface Mount Solder UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled DIP, 0.3" (7.62mm) Row Spacing SOIC Active 16 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass - -
    28-651000-10 28-651000-10 Aries Electronics
    RFQ

    Min: 1

    Mult: 1

    		 0 0x0x0 Bulk Correct-A-Chip® 651000 download Aries Electronics - 28-6510 1 A - Through Hole Solder - - SSOP DIP, 0.6" (15.24mm) Row Spacing Active 28 0.026" (0.65mm) - - - 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass 0.145" (3.68mm) FR4 Epoxy Glass
    20-351000-10 20-351000-10 Aries Electronics
    RFQ

    Min: 1

    Mult: 1

    		 0 0x0x0 Bulk Correct-A-Chip® 351000 download Aries Electronics - 20-3510 - Through Hole Solder - - SSOP DIP, 0.3" (7.62mm) Row Spacing Active 20 0.026" (0.65mm) - - - 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
    52-505-110 52-505-110 Aries Electronics
    RFQ

    Min: 1

    Mult: 1

    		 0 0x0x0 Bulk Correct-A-Chip® 505 download Aries Electronics - - Through Hole Solder - - PLCC PGA Obsolete 52 0.050" (1.27mm) - - - 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Brass 0.150" (3.81mm) FR4 Epoxy Glass
    20-354W00-10 20-354W00-10 Aries Electronics
    RFQ

    Min: 1

    Mult: 1

    		 0 0x0x0 Tube Correct-A-Chip® 354W00 download Aries Electronics - 20-354W 3 A 105°C Through Hole Solder UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled DIP, 0.3" (7.62mm) Row Spacing SOWIC Active 20 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Brass -
    24-354W00-10 24-354W00-10 Aries Electronics
    RFQ

    Min: 1

    Mult: 1

    		 0 0x0x0 Tube Correct-A-Chip® 354W00 download Aries Electronics - 24-354W 3 A 105°C Through Hole Solder UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled DIP, 0.3" (7.62mm) Row Spacing SOWIC Active 24 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Brass -
    220-3342-19-0602J 220-3342-19-0602J 3M
    RFQ

    Min: 1

    Mult: 1

    		 0 0x0x0 Box Textool™ download 3M Closed Frame 220 1 A -55°C ~ 125°C Through Hole Wire Wrap UL94 V-0 Polysulfone (PSU), Glass Filled DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing Active 20 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.620" (15.75mm) -
    20-350001-11-RC 20-350001-11-RC Aries Electronics
    RFQ

    Min: 1

    Mult: 1

    		 0 0x0x0 Tube Correct-A-Chip® 350000 download Aries Electronics - 20-3500 - Through Hole Solder - - SOJ DIP, 0.3" (7.62mm) Row Spacing Active 20 0.050" (1.27mm) - - - 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
    32-650000-11-RC 32-650000-11-RC Aries Electronics
    RFQ

    Min: 1

    Mult: 1

    		 0 0x0x0 Tube Correct-A-Chip® 650000 download Aries Electronics - 32-6500 - Through Hole Solder - - SOJ DIP, 0.6" (15.24mm) Row Spacing Active 32 0.050" (1.27mm) Gold - - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
    32-450001-11-RC 32-450001-11-RC Aries Electronics
    RFQ

    Min: 1

    Mult: 1

    		 0 0x0x0 Tube Correct-A-Chip® 450001 download Aries Electronics - 32-4500 - Through Hole Solder - - SOJ DIP, 0.4" (10.16mm) Row Spacing Active 32 0.050" (1.27mm) Gold - - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
    264-1300-09-0602J 264-1300-09-0602J 3M
    RFQ

    Min: 1

    Mult: 1

    		 0 0x0x0 Box Textool™ download 3M Closed Frame 264 1 A -55°C ~ 125°C Through Hole Solder UL94 V-0 Polysulfone (PSU), Glass Filled DIP, 0.8" (20.32mm) Row Spacing DIP, 0.8" (20.32mm) Row Spacing Obsolete 64 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.130" (3.30mm) -
    214-3339-19-0602J 214-3339-19-0602J 3M
    RFQ

    Min: 1

    Mult: 1

    		 0 0x0x0 Box Textool™ download 3M Closed Frame 214 1 A -55°C ~ 125°C Through Hole Wire Wrap UL94 V-0 Polysulfone (PSU), Glass Filled DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing Active 14 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.620" (15.75mm) -
    224-5248-09-0602J 224-5248-09-0602J 3M
    RFQ

    Min: 1

    Mult: 1

    		 0 0x0x0 Box Textool™ download 3M - 224 1 A -55°C ~ 125°C Through Hole Solder UL94 V-0 Polysulfone (PSU), Glass Filled DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing Obsolete 24 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.130" (3.30mm) -
    228-1277-29-0602J 228-1277-29-0602J 3M
    RFQ

    Min: 1

    Mult: 1

    		 0 0x0x0 Box Textool™ download 3M - 228 1 A -55°C ~ 125°C Through Hole Solder UL94 V-0 Polysulfone (PSU), Glass Filled DIP, 0.6" (15.24mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing Obsolete 28 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.130" (3.30mm) -
    228-1290-09-0602J 228-1290-09-0602J 3M
    RFQ

    Min: 1

    Mult: 1

    		 0 0x0x0 Box Textool™ download 3M - 228 1 A -55°C ~ 125°C Through Hole Solder UL94 V-0 Polysulfone (PSU), Glass Filled DIP, 0.4" (10.16mm) Row Spacing DIP, 0.4" (10.16mm) Row Spacing Active 28 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.130" (3.30mm) -

    Microchip Technology PIC18F24J11T-I/SS

    Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

    • Manufacturer No:

      PIC1 8F24J11T-/SS

    • Manufacturer No:

      PIC1 8F24J11T-/SS

    • Manufacturer No:

      PIC1 8F24J11T-/SS

    • Manufacturer No:

      PIC1 8F24J11T-/SS

    • Description:

      16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

    -
    +
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    RFQ List (0 Items)
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