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Blade Type Power Connectors(115)

Manufacturer

Manufacturer

  • 3M
  • Analog Devices Inc./Maxim Integrated
  • Aries Electronics
  • Logical Systems Inc.
  • MikroElektronika
  • TE Connectivity Deutsch Connectors

Packaging

Packaging

  • Bag
  • Box
  • Bulk
  • Tube

Product Status

Product Status

  • Active
  • Discontinued at Digi-Key
  • Obsolete

Series

Series

  • *
  • 647
  • Correct-A-Chip®
  • Correct-A-Chip® 1106396
  • Correct-A-Chip® 1107254
  • Correct-A-Chip® 1109252
  • Correct-A-Chip® 1109342
  • Correct-A-Chip® 1109522
  • Correct-A-Chip® 1109523
  • Correct-A-Chip® 1110087
  • Correct-A-Chip® 1110267-N
  • Correct-A-Chip® 1111163
  • Correct-A-Chip® 1111841
  • Correct-A-Chip® 1111903
  • Correct-A-Chip® 301296
  • Correct-A-Chip® 301550
  • Correct-A-Chip® 304235
  • Correct-A-Chip® 304504
  • Correct-A-Chip® 304538
  • Correct-A-Chip® 304633
  • Correct-A-Chip® 305263
  • Correct-A-Chip® 305479
  • Correct-A-Chip® 307349
  • Correct-A-Chip® 350000
  • Correct-A-Chip® 351000
  • Correct-A-Chip® 352000
  • Correct-A-Chip® 353000
  • Correct-A-Chip® 354000
  • Correct-A-Chip® 354W00
  • Correct-A-Chip® 35W000
  • Correct-A-Chip® 450001
  • Correct-A-Chip® 505
  • Correct-A-Chip® 555000
  • Correct-A-Chip® 650000
  • Correct-A-Chip® 651000
  • Correct-A-Chip® 652000
  • Correct-A-Chip® 653000
  • Correct-A-Chip® 655000
  • Correct-A-Chip® 6645
  • Correct-A-Chip® 665000
  • Correct-A-Chip® 666000
  • Correct-A-Chip® 68340
  • Correct-A-Chip® 95-132I25
  • Correct-A-Chip® 96-160M65
  • Correct-A-Chip® 96-208M50
  • Correct-A-Chip® 97-56001
  • Correct-A-Chip® 97-68340
  • Correct-A-Chip® 97-AQ132D
  • DS9075
  • Textool™

Board Material

Board Material

  • -
  • FR4 Epoxy Glass
  • Polyimide (PI)

Contact Finish - Mating

Contact Finish - Mating

  • Silver

Contact Finish - Post

Contact Finish - Post

  • Gold
  • Tin
  • Tin-Lead

Convert From (Adapter End)

Convert From (Adapter End)

  • AT90PWM1
  • AT90PWM2
  • HB2E Relay
  • MSOP
  • Multiple Packages
  • PQFP
  • SIP
  • Socket, 0.6" (15.24mm) Row Spacing
  • SOIC-W
  • SOJ
  • SSOP
  • TQFP
  • TSOP
  • VQFP

Convert To (Adapter End)

Convert To (Adapter End)

  • DIP
  • DIP, 0.3" (7.62mm) Row Spacing
  • DIP, 0.4" (10.16mm) Row Spacing
  • DIP, 0.6" (15.24mm) Row Spacing
  • DIP, 0.8" (20.32mm) Row Spacing
  • DIP, 0.9" (22.86mm) Row Spacing
  • DIP, 1.0" (25.40mm) Row Spacing
  • JEDEC
  • PGA
  • PLCC
  • QFP
  • SOIC
  • SOWIC

Housing Material

Housing Material

  • Polyamide (PA46), Nylon 4/6, Glass Filled
  • Polyester
  • Polyphenylene Sulfide (PPS)
  • Polysulfone (PSU), Glass Filled

Mounting Type

Mounting Type

  • Surface Mount
  • Through Hole

Number of Pins

Number of Pins

  • 10
  • 100
  • 12
  • 128
  • 132
  • 14
  • 144
  • 16
  • 160
  • 169
  • 18
  • 184
  • 20
  • 208
  • 22
  • 24
  • 26
  • 28
  • 32
  • 36
  • 40
  • 42
  • 44
  • 48
  • 52
  • 56
  • 60
  • 64
  • 68
  • 8
  • 80
  • 84
  • 90

Pitch - Mating

Pitch - Mating

  • 0.020" (0.50mm)
  • 0.024" (0.60mm)
  • 0.025" (0.64mm)
  • 0.026" (0.65mm)

Pitch - Post

Pitch - Post

  • 0.031" (0.80mm)
  • 0.050" (1.27mm)
  • 0.070" (1.78mm)
  • 0.100" (2.54mm)

Termination

Termination

  • Solder
  • Wire Wrap
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    Compare Image Name Manufacturer Quantity Weight(Kg) Size(LxWxH) Package Series Datasheet Mfr Features Base Product Number Current Rating (Amps) Operating Temperature Mounting Type Termination Material Flammability Rating Housing Material Convert From (Adapter End) Convert To (Adapter End) Product Status Number of Pins Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Termination Post Length Board Material
    96-128M80 96-128M80 Aries Electronics
    RFQ

    Min: 1

    Mult: 1

    		 0 0x0x0 Correct-A-Chip® Aries Electronics - 105°C Through Hole Solder - - QFP PGA Obsolete 128 0.031" (0.80mm) Tin - Copper 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy 0.125" (3.18mm) FR4 Epoxy Glass
    96-208M50 96-208M50 Aries Electronics
    RFQ

    Min: 1

    Mult: 1

    		 0 0x0x0 Bulk Correct-A-Chip® 96-208M50 download Aries Electronics - 96-208M - Through Hole Solder - - QFP PGA Active 208 0.020" (0.50mm) Tin - Copper 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
    97-68340 97-68340 Aries Electronics
    RFQ

    Min: 1

    Mult: 1

    		 0 0x0x0 Bulk Correct-A-Chip® 97-68340 download Aries Electronics - 97-6834 - Through Hole Solder - - QFP PGA Active 144 0.026" (0.65mm) Tin - Copper 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
    218-3341-19-0602J 218-3341-19-0602J 3M
    RFQ

    Min: 1

    Mult: 1

    		 0 0x0x0 Box Textool™ download 3M Closed Frame 218 1 A -55°C ~ 125°C Through Hole Wire Wrap UL94 V-0 Polysulfone (PSU), Glass Filled DIP, 0.3" (7.62mm) Row Spacing DIP, 0.3" (7.62mm) Row Spacing Active 18 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper 0.620" (15.75mm) -
    16-35W000-10 16-35W000-10 Aries Electronics
    RFQ

    Min: 1

    Mult: 1

    		 0 0x0x0 Bulk Correct-A-Chip® 35W000 download Aries Electronics - 16-35W0 - Through Hole Solder - - SOIC-W DIP, 0.3" (7.62mm) Row Spacing Active 16 0.050" (1.27mm) - - - 0.100" (2.54mm) Tin-Lead - Brass 0.125" (3.18mm) FR4 Epoxy Glass
    24-35W000-10 24-35W000-10 Aries Electronics
    RFQ

    Min: 1

    Mult: 1

    		 0 0x0x0 Bulk Correct-A-Chip® 35W000 download Aries Electronics - 24-35W0 - Through Hole Solder - - SOIC-W DIP, 0.3" (7.62mm) Row Spacing Active 24 0.050" (1.27mm) - - - 0.100" (2.54mm) Tin-Lead - Brass 0.125" (3.18mm) FR4 Epoxy Glass
    28-450001-10 28-450001-10 Aries Electronics
    RFQ

    Min: 1

    Mult: 1

    		 0 0x0x0 Bulk Correct-A-Chip® 450001 download Aries Electronics - 28-4500 - Through Hole Solder - - SOJ DIP, 0.4" (10.16mm) Row Spacing Active 28 0.050" (1.27mm) - - - 0.100" (2.54mm) - - - 0.125" (3.18mm) FR4 Epoxy Glass
    44-647-10 44-647-10 Aries Electronics
    RFQ

    Min: 1

    Mult: 1

    		 0 0x0x0 Bulk 647 download Aries Electronics - 44-647 3 A - Through Hole Solder - - SOIC DIP, 0.6" (15.24mm) Row Spacing Active 44 - Gold 10.0µin (0.25µm) Beryllium Copper - Tin 200.0µin (5.08µm) Phosphor Bronze 0.180" (4.57mm) -
    1109342 1109342 Aries Electronics
    RFQ

    Min: 1

    Mult: 1

    		 0 0x0x0 Bulk Correct-A-Chip® 1109342 Aries Electronics - 1109342 105°C Through Hole Solder UL94 V-0 Polyphenylene Sulfide (PPS) PLCC DIP, 0.6" (15.24mm) Row Spacing Active 44 - Tin 150.0µin (3.81µm) Phosphor Bronze 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
    36-651000-10 36-651000-10 Aries Electronics
    RFQ

    Min: 1

    Mult: 1

    		 0 0x0x0 Bulk Correct-A-Chip® 651000 Aries Electronics - 36-6510 105°C Through Hole Solder - - SSOP DIP, 0.6" (15.24mm) Row Spacing Active 36 0.026" (0.65mm) Tin - Copper 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
    DS9075-40V/NO-BRAND DS9075-40V/NO-BRAND Analog Devices Inc./Maxim Integrated
    RFQ

    Min: 1

    Mult: 1

    		 0 0x0x0 Bulk DS9075 download Analog Devices Inc./Maxim Integrated - DS9075 - - - - - SIP DIP Obsolete 40 - - - - - - - - - -
    32-655000-10 32-655000-10 Aries Electronics
    RFQ

    Min: 1

    Mult: 1

    		 0 0x0x0 Bulk Correct-A-Chip® 655000 download Aries Electronics - 32-6550 - Through Hole Solder - - TSOP DIP, 0.6" (15.24mm) Row Spacing Active 32 0.020" (0.50mm) Silver - Copper 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
    08-354000-10 08-354000-10 Aries Electronics
    RFQ

    Min: 1

    Mult: 1

    		 0 0x0x0 Bulk Correct-A-Chip® 354000 Aries Electronics - 08-3540 3 A 105°C Surface Mount Solder UL94 V-0 Polyamide (PA46), Nylon 4/6, Glass Filled DIP, 0.3" (7.62mm) Row Spacing SOIC Active 8 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper 0.050" (1.27mm) Gold 200.0µin (5.08µm) Brass - -
    97-AQ132D 97-AQ132D Aries Electronics
    RFQ

    Min: 1

    Mult: 1

    		 0 0x0x0 Bulk Correct-A-Chip® 97-AQ132D download Aries Electronics - 97-AQ13 - Through Hole Solder - - PQFP PGA Active 132 0.025" (0.64mm) Gold - - - Tin-Lead 200.0µin (5.08µm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
    44-305263-20 44-305263-20 Aries Electronics
    RFQ

    Min: 1

    Mult: 1

    		 0 0x0x0 Bulk Correct-A-Chip® 305263 download Aries Electronics - 44-3052 - Through Hole Solder - - QFP PLCC Active 44 0.024" (0.60mm) - - - 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Brass 0.090" (2.29mm) FR4 Epoxy Glass

    Microchip Technology PIC18F24J11T-I/SS

    Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

    • Manufacturer No:

      PIC1 8F24J11T-/SS

    • Manufacturer No:

      PIC1 8F24J11T-/SS

    • Manufacturer No:

      PIC1 8F24J11T-/SS

    • Manufacturer No:

      PIC1 8F24J11T-/SS

    • Description:

      16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

    -
    +
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    RFQ List (0 Items)
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