CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

Compare Image Name Manufacturer Quantity Weight(Kg) Size(LxWxH) Package Type Series Datasheet Mfr Base Product Number Ratings Operating Temperature Mounting Type Size / Dimension Package / Case Approval Agency Lead Spacing Height - Seated (Max) Product Status Voltage - Max Current - Hold (Ih) (Max) Current - Max Thickness (Max) Current - Trip (It) Time to Trip Resistance - Initial (Ri) (Min) Resistance - Post Trip (R1) (Max) Resistance - 25°C (Typ)
B59955C0160A070 B59955C0160A070 EPCOS - TDK Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Bulk Ceramic Automotive, AEC-Q200 download EPCOS - TDK Electronics AEC-Q200 -40°C ~ 85°C Through Hole 0.532" Dia x 0.138" T (13.50mm x 3.50mm) Radial, Disc UR 0.197" (5.00mm) 0.669" (17.00mm) Active 20V 950 mA 5.5 A - 1.9 A 800 mOhms
B59830C0120A070 B59830C0120A070 EPCOS - TDK Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Bulk Ceramic - download EPCOS - TDK Electronics - 0°C ~ 60°C Through Hole 0.866" Dia x 0.197" T (22.00mm x 5.00mm) Radial, Disc UR 0.197" (5.00mm) 1.004" (25.50mm) Active 265V 460 mA 7 A - 920 mA 3.7 Ohms
B59810C0130A070 B59810C0130A070 EPCOS - TDK Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Bulk Ceramic - download EPCOS - TDK Electronics - 0°C ~ 60°C Through Hole 0.866" Dia x 0.197" T (22.00mm x 5.00mm) Radial, Disc UR 0.197" (5.00mm) 1.004" (25.50mm) Active 265V 650 mA 7 A - 980 mA 3.5 Ohms
B59773B0120A070 B59773B0120A070 EPCOS - TDK Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Bulk Ceramic Automotive, AEC-Q200 download EPCOS - TDK Electronics - 0°C ~ 60°C Through Hole 0.335" Dia x 0.276" T (8.50mm x 7.00mm) Radial, Disc UL 0.197" (5.00mm) 0.197" (5.00mm) Active 550V 1 A - 48 mA 3 s 500 Ohms
B59945C0120A070 B59945C0120A070 EPCOS - TDK Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Bulk Ceramic Automotive, AEC-Q200 download EPCOS - TDK Electronics AEC-Q200 -40°C ~ 85°C Through Hole 0.689" Dia x 0.138" T (17.50mm x 3.50mm) Radial, Disc UR 0.197" (5.00mm) 0.827" (21.00mm) Active 30V 1.3 A 8 A - 2.6 A 450 mOhms
B59873C0120A051 B59873C0120A051 EPCOS - TDK Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Tape & Reel (TR) Ceramic - download EPCOS - TDK Electronics - 0°C ~ 60°C Through Hole 0.354" Dia x 0.197" T (9.00mm x 5.00mm) Radial, Disc UR 0.197" (5.00mm) 0.492" (12.50mm) Active 265V 70 mA 1 A - 140 mA 45 Ohms
B59772B0120A070 B59772B0120A070 EPCOS - TDK Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Bulk Ceramic Automotive, AEC-Q200 download EPCOS - TDK Electronics - 0°C ~ 60°C Through Hole 0.335" Dia x 0.276" T (8.50mm x 7.00mm) Radial, Disc UL 0.197" (5.00mm) 0.197" (5.00mm) Active 420V 1.4 A - 86 mA 3 s 150 Ohms
B59995C0120A051 B59995C0120A051 EPCOS - TDK Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Tape & Reel (TR) Ceramic Automotive, AEC-Q200 download EPCOS - TDK Electronics - -40°C ~ 85°C Through Hole 0.157" Dia x 0.138" T (4.00mm x 3.50mm) Radial, Disc UR 0.197" (5.00mm) 0.295" (7.50mm) Active 30V 120 mA 700 mA - 240 mA 13 Ohms
B59886C0120A051 B59886C0120A051 EPCOS - TDK Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Tape & Reel (TR) Ceramic - download EPCOS - TDK Electronics - 0°C ~ 60°C Through Hole 0.256" Dia x 0.197" T (6.50mm x 5.00mm) Radial, Disc UR 0.197" (5.00mm) 0.394" (10.00mm) Active 550V 12 mA 100 mA - 24 mA 1.5 kOhms
B59890C0120A051 B59890C0120A051 EPCOS - TDK Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Tape & Reel (TR) Ceramic - download EPCOS - TDK Electronics - 0°C ~ 60°C Through Hole 0.157" Dia x 0.197" T (4.00mm x 5.00mm) Radial, Disc UR, VDE 0.197" (5.00mm) 0.295" (7.50mm) Active 265V 30 mA 200 mA - 60 mA 150 Ohms
MF-MSMF020-2 MF-MSMF020-2 Bourns Inc.
RFQ

Min: 1

Mult: 1

0 0x0x0 Tape & Reel (TR) Polymeric Multifuse®, MF-MSMF download Bourns Inc. MF-MSMF AEC-Q200 -40°C ~ 85°C Surface Mount 0.179" L x 0.128" W (4.55mm x 3.24mm) 1812 (4532 Metric), Concave cURus, TUV - - Active 30V 200 mA 80 A 0.043" (1.10mm) 400 mA 60 ms 400 mOhms 6 Ohms
MF-MSMF075-2 MF-MSMF075-2 Bourns Inc.
RFQ

Min: 1

Mult: 1

0 0x0x0 Tape & Reel (TR) Polymeric Multifuse®, MF-MSMF download Bourns Inc. MF-MSMF AEC-Q200 -40°C ~ 85°C Surface Mount 0.179" L x 0.128" W (4.55mm x 3.24mm) 1812 (4532 Metric), Concave cURus, TUV - - Active 13.2V 750 mA 100 A 0.033" (0.85mm) 1.5 A 200 ms 110 mOhms 450 mOhms
MF-MSMF075/24-2 MF-MSMF075/24-2 Bourns Inc.
RFQ

Min: 1

Mult: 1

0 0x0x0 Tape & Reel (TR) Polymeric Multifuse®, MF-MSMF download Bourns Inc. MF-MSMF AEC-Q200 -40°C ~ 85°C Surface Mount 0.179" L x 0.128" W (4.55mm x 3.24mm) 1812 (4532 Metric), Concave cURus, TUV - - Active 24V 750 mA 40 A 0.033" (0.85mm) 1.5 A 200 ms 110 mOhms 450 mOhms
MF-MSMF110-2 MF-MSMF110-2 Bourns Inc.
RFQ

Min: 1

Mult: 1

0 0x0x0 Tape & Reel (TR) Polymeric Multifuse®, MF-MSMF download Bourns Inc. MF-MSMF AEC-Q200 -40°C ~ 85°C Surface Mount 0.181" L x 0.128" W (4.60mm x 3.24mm) 1812 (4532 Metric), Concave cURus, TUV - - Active 6V 1.1 A 100 A 0.033" (0.85mm) 2.2 A 300 ms 40 mOhms 210 mOhms
MF-MSMF125-2 MF-MSMF125-2 Bourns Inc.
RFQ

Min: 1

Mult: 1

0 0x0x0 Tape & Reel (TR) Polymeric Multifuse®, MF-MSMF download Bourns Inc. MF-MSMF AEC-Q200 -40°C ~ 85°C Surface Mount 0.179" L x 0.128" W (4.55mm x 3.24mm) 1812 (4532 Metric), Concave cURus, TUV - - Active 6V 1.25 A 100 A 0.033" (0.85mm) 2.5 A 400 ms 35 mOhms 140 mOhms

Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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