CPU, MCU, FPGA, GPS, IGBT, MOSFETSOC, sensor, memory chip, videosurveillance chip, RF chip, power device,Power chip,Touch chip, WiFi chip.Bluetooth chip, capacitance, resistance, inductor, crystal oscillator, diode.Triode,relay, connector, LED, etc.

Compare Image Name Manufacturer Quantity Weight(Kg) Size(LxWxH) Package Type Series Datasheet Mfr Base Product Number Ratings Operating Temperature Mounting Type Size / Dimension Package / Case Approval Agency Lead Spacing Height - Seated (Max) Product Status Voltage - Max Current - Hold (Ih) (Max) Current - Max Thickness (Max) Current - Trip (It) Time to Trip Resistance - Initial (Ri) (Min) Resistance - Post Trip (R1) (Max) Resistance - 25°C (Typ)
B59950C0130A070 B59950C0130A070 EPCOS - TDK Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Bulk Ceramic Automotive, AEC-Q200 download EPCOS - TDK Electronics - -40°C ~ 125°C Through Hole 0.433" Dia x 0.138" T (11.00mm x 3.50mm) Radial, Disc UR 0.197" (5.00mm) 0.571" (14.50mm) Active 80V 320 mA 4.3 A - 500 mA 4.9 Ohms
B59955C0120A070 B59955C0120A070 EPCOS - TDK Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Bulk Ceramic Automotive, AEC-Q200 download EPCOS - TDK Electronics AEC-Q200 -40°C ~ 125°C Through Hole 0.532" Dia x 0.138" T (13.50mm x 3.50mm) Radial, Disc UR 0.197" (5.00mm) 0.669" (17.00mm) Active 30V 850 mA 5.5 A - 1.7 A 800 mOhms
B59754B0120A070 B59754B0120A070 EPCOS - TDK Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Bulk Ceramic - download EPCOS - TDK Electronics - 0°C ~ 60°C Through Hole 0.492" Dia x 0.276" T (12.50mm x 7.00mm) Radial, Disc UL 0.197" (5.00mm) 0.650" (16.50mm) Active 420V 2 A - 100 mA 3 s 150 Ohms
B59995C0160A070 B59995C0160A070 EPCOS - TDK Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Bulk Ceramic Automotive, AEC-Q200 download EPCOS - TDK Electronics - -40°C ~ 85°C Through Hole 0.157" Dia x 0.138" T (4.00mm x 3.50mm) Radial, Disc UR, VDE 0.197" (5.00mm) 0.295" (7.50mm) Active 20V 150 mA 700 mA - 300 mA 13 Ohms
B59940C0120A070 B59940C0120A070 EPCOS - TDK Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Bulk Ceramic Automotive, AEC-Q200 download EPCOS - TDK Electronics - -40°C ~ 125°C Through Hole 0.866" Dia x 0.138" T (22.00mm x 3.50mm) Radial, Disc UR 0.197" (5.00mm) 1.004" (25.50mm) Active 80V 450 mA 8 A - 900 mA 2.3 Ohms
B59910C0130A070 B59910C0130A070 EPCOS - TDK Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Bulk Ceramic - download EPCOS - TDK Electronics - 0°C ~ 60°C Through Hole 0.866" Dia x 0.138" T (22.00mm x 3.50mm) Radial, Disc UR 0.197" (5.00mm) 1.004" (25.50mm) Active 80V 1 A 10 A - 1.5 A 1.2 Ohms
B59945C0160A070 B59945C0160A070 EPCOS - TDK Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Bulk Ceramic Automotive, AEC-Q200 download EPCOS - TDK Electronics AEC-Q200 -40°C ~ 85°C Through Hole 0.689" Dia x 0.138" T (17.50mm x 3.50mm) Radial, Disc UR 0.197" (5.00mm) 0.827" (21.00mm) Active 20V 1.5 A 8 A - 3.05 A 450 mOhms
B59774B0115A070 B59774B0115A070 EPCOS - TDK Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Bulk Ceramic Automotive, AEC-Q200 download EPCOS - TDK Electronics - 0°C ~ 60°C Through Hole 0.335" Dia x 0.276" T (8.50mm x 7.00mm) Radial, Disc UL 0.197" (5.00mm) 0.197" (5.00mm) Active 550V 1 A - 32 mA 2 s 1.1 kOhms
B59770B0120A070 B59770B0120A070 EPCOS - TDK Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Bulk Ceramic Automotive, AEC-Q200 download EPCOS - TDK Electronics - 0°C ~ 60°C Through Hole 0.335" Dia x 0.276" T (8.50mm x 7.00mm) Radial, Disc UL 0.197" (5.00mm) 0.197" (5.00mm) Active 420V 1.4 A - 127 mA 4 s 70 Ohms
B59980C0120A051 B59980C0120A051 EPCOS - TDK Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Tape & Reel (TR) Ceramic Automotive, AEC-Q200 download EPCOS - TDK Electronics - -40°C ~ 125°C Through Hole 0.256" Dia x 0.138" T (6.50mm x 3.50mm) Radial, Disc UR 0.197" (5.00mm) 0.394" (10.00mm) Active 80V 85 mA 1 A - 170 mA 25 Ohms
B59985C0120A051 B59985C0120A051 EPCOS - TDK Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Tape & Reel (TR) Ceramic Automotive, AEC-Q200 download EPCOS - TDK Electronics AEC-Q200 -40°C ~ 85°C Through Hole 0.256" Dia x 0.138" T (6.50mm x 3.50mm) Radial, Disc UR 0.197" (5.00mm) 0.394" (10.00mm) Active 30V 250 mA 1 A - 500 mA 4.6 Ohms
B59885C0120A070 B59885C0120A070 EPCOS - TDK Electronics
RFQ

Min: 1

Mult: 1

0 0x0x0 Bulk Ceramic - download EPCOS - TDK Electronics - 0°C ~ 60°C Through Hole 0.256" Dia x 0.197" T (6.50mm x 5.00mm) Radial, Disc UR 0.197" (5.00mm) 0.394" (10.00mm) Active 550V 15 mA 100 mA - 30 mA 1.2 kOhms
MF-MSMF010-2 MF-MSMF010-2 Bourns Inc.
RFQ

Min: 1

Mult: 1

0 0x0x0 Tape & Reel (TR) Polymeric Multifuse®, MF-MSMF download Bourns Inc. MF-MSMF AEC-Q200 -40°C ~ 85°C Surface Mount 0.179" L x 0.128" W (4.55mm x 3.24mm) 1812 (4532 Metric), Concave cURus, TUV - - Active 60V 100 mA 40 A 0.043" (1.10mm) 300 mA 1.5 s 700 mOhms 15 Ohms
MF-MSMF014-2 MF-MSMF014-2 Bourns Inc.
RFQ

Min: 1

Mult: 1

0 0x0x0 Tape & Reel (TR) Polymeric Multifuse®, MF-MSMF download Bourns Inc. MF-MSMF AEC-Q200 -40°C ~ 85°C Surface Mount 0.179" L x 0.128" W (4.55mm x 3.24mm) 1812 (4532 Metric), Concave cURus, TUV - - Active 60V 140 mA 40 A 0.043" (1.10mm) 340 mA 150 ms 400 mOhms 6.5 Ohms
MF-MSMF030-2 MF-MSMF030-2 Bourns Inc.
RFQ

Min: 1

Mult: 1

0 0x0x0 Tape & Reel (TR) Polymeric Multifuse®, MF-MSMF download Bourns Inc. MF-MSMF AEC-Q200 -40°C ~ 85°C Surface Mount 0.179" L x 0.128" W (4.55mm x 3.24mm) 1812 (4532 Metric), Concave cURus, TUV - - Active 30V 300 mA 10 A 0.043" (1.10mm) 600 mA 100 ms 300 mOhms 3 Ohms

Microchip Technology PIC18F24J11T-I/SS

Microcontroller 28 Pin PIC@ XLP" 18J Series PIC18F24J11 3V 28-SSOP.

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Manufacturer No:

    PIC1 8F24J11T-/SS

  • Description:

    16KB 8Kx 16 FLASH PIC 8-Bit Microcontroller PIC XLP" 18J Series PIC1 8F24J11 28 Pin 48MHz 3V 28-SSOP (0.209, 5.30mm Width)

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